MooresLabAI at DAC 2026: Why the Future of Semiconductor Engineering Is Agentic, Not Just Generative

MooresLabAI at DAC 2026: Why the Future of Semiconductor Engineering Is Agentic, Not Just Generative
by Daniel Nenni on 07-08-2026 at 2:00 pm

DAC MLAI BuildingTheFuture

For decades, semiconductor innovation has been constrained not by imagination, but by engineering capacity. While transistor density has continued to advance, the process of building chips has remained fundamentally manual, fragmented across specifications, RTL, verification, debugging, coverage analysis, and signoff.… Read More


Moores Lab(AI): Agentic AI and the New Era of Semiconductor Design

Moores Lab(AI): Agentic AI and the New Era of Semiconductor Design
by Kalar Rajendiran on 10-08-2025 at 10:00 am

Silicon Engineering at the Speed of AI

For decades, chip design has been a delicate balance of creativity and drudgery. Architects craft detailed specifications, engineers read those documents line by line, and teams write and debug thousands of lines of Verilog and UVM code. Verification alone can consume up to 35 percent of a project’s cost and add many months to … Read More