Terafab’s Single Roof: Why Packaging, Not Lithography, Decides High Volume

Terafab’s Single Roof: Why Packaging, Not Lithography, Decides High Volume
by Admin on 10-16-2026 at 6:00 am

Single Roof, Connected Silicon

By Shaurya Seth

Terafab is one of the most ambitious projects of the decade: $16.8 billion for phase one and up to $119 billion across four phases. A research fab in Austin iterates on process recipes, transistor designs, and packaging variants at a few thousand wafers per month. A volume fab in Grimes County targets 100,000 wafer… Read More


HBM’s Vertical Ascent: Why Packaging Is Becoming the Heart of AI Memory

HBM’s Vertical Ascent: Why Packaging Is Becoming the Heart of AI Memory
by Admin on 09-03-2026 at 6:00 am

HBM’s Vertical Ascent

SK hynix’s Hot Chips 2026 presentation explains how High Bandwidth Memory (HBM) is evolving to meet the extraordinary memory requirements of artificial intelligence. Its central message is that future progress will depend not only on better DRAM circuits but also on advanced packaging, denser vertical integration, improved… Read More