How TSMC Tackles Variation at Advanced Nodes

How TSMC Tackles Variation at Advanced Nodes
by Pawan Fangaria on 05-27-2016 at 12:00 pm

The design community is always hungry for high-performance, low-power, and low-cost devices. There is emergence of FinFET and FDSOI technologies at ultra-low process nodes to provide high-performance and low-power requirements at lower die-size. However, these advanced process nodes are prone to new sources of variation.… Read More