Beyond Moore: Co-Optimizing AI from Systems to Materials

Beyond Moore: Co-Optimizing AI from Systems to Materials
by Daniel Nenni on 08-18-2026 at 10:00 am

Beyond Moore AI from manufacturing to Systems

At the OCP APAC Summit in Taiwan, August 11–12, 2026, Applied Materials’ Subi Kengeri framed artificial intelligence as the semiconductor industry’s largest inflection point. AI demand is accelerating the industry toward one trillion dollars in annual revenue, but the keynote’s central message was more consequential than… Read More