The Era of Chiplets and Heterogeneous Integration: Challenges and Emerging Solutions to Support 2.5D and 3D Advanced Packaging

The Era of Chiplets and Heterogeneous Integration: Challenges and Emerging Solutions to Support 2.5D and 3D Advanced Packaging
by Kalar Rajendiran on 12-27-2022 at 6:00 am

High End Performance Packaging Spectrum

From the multi-chip-modules (MCM) of yester years to today’s System-in-Package (SiP) implementations, things have progressed a lot in terms of package technology. The chiplet movement is not only a big beneficiary of today’s advanced package technologies but drives further advances in this technology area. While a chiplets-based… Read More


proteanTecs Technology Helps GUC Characterize Its GLink™ High-Speed Interface

proteanTecs Technology Helps GUC Characterize Its GLink™ High-Speed Interface
by Kalar Rajendiran on 11-15-2022 at 6:00 am

proteanTecs D2D Monitoring Hardware Block Diagram

An earlier post on SemiWiki discussed how deep data analytics helps accelerate SoC product development. The post presented insights into proteanTecs’ technology and quantified the benefits that can be derived by leveraging the software platform for SoC product development. You can review that earlier blog here. The power … Read More