Intel’s next big opportunity could come from something that sounds spectacularly unglamorous: connecting tiny pieces of silicon. Advanced packaging rarely attracts the attention lavished on powerful processors or artificial intelligence models. Yet it increasingly determines how effectively those technologies perform.… Read More
TSMC reportedly plans to double its Chip-on-Wafer-on-Substrate capacity from approximately 130,000 300mm-equivalent wafers per month at the end of 2026 to 260,000 by 2028. The estimate is not formal company guidance and should be treated as a supply-chain projection. Nevertheless, the direction is consistent with TSMC’s… Read More
On the last day of #DAC2026 I stopped by the Keysight booth to chat with Nilesh Kamdar, GM of EDA Business to get an update. He has spent 27 years in the industry, and this made 25 DAC trips for him. For Keysight the application areas of focus are serving designers of high frequency and high-speed digital, RF, and mm/uwave designs. An … Read More
Intel is considering a return to memory technology decades after abandoning mainstream DRAM and, more recently, selling its NAND business. Chief executive Lip-Bu Tan has argued that memory should no longer be viewed simply as a low-margin commodity. Artificial intelligence is turning bandwidth, latency and data movement … Read More
