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Will wafer to wafer bonding be the next big advances in semis?

A

Arthur Hanson

Well-known member
Will wafer to wafer bonding be the next big advance in semis and how does it compare to silicon on fabric integration? Is AMAT a leader in both? Any thoughts or comments would be appreciated.

fuentitech.com

Applied Materials Improves Die-Wafer and Wafer-Wafer Bonding - Fuentitech

Development is improved software modeling and simulation. Die-to-wafer hybrid bonding – Uses copper-to-copper direct interconnect to increase I / O density and reduce wire length between chiplets. This allows parameters such as material selection and packaging architecture to be evaluated and...
fuentitech.com fuentitech.com
 
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