HSINCHU, Taiwan, R.O.C., Nov. 14, 2023 – TSMC (TWSE: 2330, NYSE: TSM) today held a
meeting of the Board of Directors, which passed the following resolutions:
1. Approved the distribution of a NT$3.50 per share cash dividend for the third quarter of 2023, and set March 24, 2024 as the record date for common stock shareholders entitled to participate in this cash dividend distribution, and the ex-dividend date for the common shares shall be March 18, 2024. As required by Article 165 of Taiwan’s Company Law, the shareholders’ register shall be closed for five days prior to the record date (March 20 through March 24, 2024) for registration transfer, and the dividend will be paid on April 11, 2024. In addition, the ex-dividend date for TSMC American Depositary Shares (ADSs) will be March 18, 2024. The record date for TSMC ADSs entitled to participate in this cash dividend distribution will be March 19, 2024.
2. Approved capital appropriations of approximately US$4,341.95 million for purposes including:
1) Installation of advanced technology capacity; 2) Installation of advanced packaging, mature and specialty technology capacity; 3) 2024 R&D capital investments and sustaining capital expenditures; 4) 2024 capitalized leased assets.
About TSMC
TSMC pioneered the pure-play foundry business model when it was founded in 1987, and has been the world’s leading dedicated semiconductor foundry ever since. The Company supports a thriving ecosystem of global customers and partners with the industry’s leading process technologies and portfolio of design enablement solutions to unleash innovation for the global semiconductor industry. With global operations spanning Asia, Europe, and North America, TSMC serves as a committed
corporate citizen around the world.
TSMC deployed 288 distinct process technologies, and manufactured 12,698 products for 532 customers in 2022 by providing broadest range of advanced, specialty and advanced packaging technology services. The Company is headquartered in Hsinchu, Taiwan. For more information please visit https://www.tsmc.com.
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TSMC Spokesperson:
Wendell Huang
Vice President and CFO
Tel: 886-3-505-5901
Media Contacts:
Nina Kao
Head of Public Relations
Tel: 886-3-5636688 ext.7125036
Mobile: 886-988-239-163
E-Mail: nina_kao@tsmc.com
Baker Li
Public Relations
Tel: 886-3-5636688 ext.7125037
Mobile: 886-988-932-757
E-Mail: baker_li@tsmc.com
meeting of the Board of Directors, which passed the following resolutions:
1. Approved the distribution of a NT$3.50 per share cash dividend for the third quarter of 2023, and set March 24, 2024 as the record date for common stock shareholders entitled to participate in this cash dividend distribution, and the ex-dividend date for the common shares shall be March 18, 2024. As required by Article 165 of Taiwan’s Company Law, the shareholders’ register shall be closed for five days prior to the record date (March 20 through March 24, 2024) for registration transfer, and the dividend will be paid on April 11, 2024. In addition, the ex-dividend date for TSMC American Depositary Shares (ADSs) will be March 18, 2024. The record date for TSMC ADSs entitled to participate in this cash dividend distribution will be March 19, 2024.
2. Approved capital appropriations of approximately US$4,341.95 million for purposes including:
1) Installation of advanced technology capacity; 2) Installation of advanced packaging, mature and specialty technology capacity; 3) 2024 R&D capital investments and sustaining capital expenditures; 4) 2024 capitalized leased assets.
About TSMC
TSMC pioneered the pure-play foundry business model when it was founded in 1987, and has been the world’s leading dedicated semiconductor foundry ever since. The Company supports a thriving ecosystem of global customers and partners with the industry’s leading process technologies and portfolio of design enablement solutions to unleash innovation for the global semiconductor industry. With global operations spanning Asia, Europe, and North America, TSMC serves as a committed
corporate citizen around the world.
TSMC deployed 288 distinct process technologies, and manufactured 12,698 products for 532 customers in 2022 by providing broadest range of advanced, specialty and advanced packaging technology services. The Company is headquartered in Hsinchu, Taiwan. For more information please visit https://www.tsmc.com.
# # #
TSMC Spokesperson:
Wendell Huang
Vice President and CFO
Tel: 886-3-505-5901
Media Contacts:
Nina Kao
Head of Public Relations
Tel: 886-3-5636688 ext.7125036
Mobile: 886-988-239-163
E-Mail: nina_kao@tsmc.com
Baker Li
Public Relations
Tel: 886-3-5636688 ext.7125037
Mobile: 886-988-932-757
E-Mail: baker_li@tsmc.com