TSMC and Amkor Technology Announce Long Term Partnership to Accelerate Advanced Packaging in the United States

[Daniel Nenni]

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HSINCHU, Taiwan & TEMPE, Ariz., June 16, 2026--(BUSINESS WIRE)--Taiwan Semiconductor Manufacturing Company (NYSE: TSM) and Amkor Technology, Inc. (Nasdaq: AMKR) today announced a 10-year agreement to foster a strong partnership that will enhance advanced semiconductor packaging capabilities in Arizona, strengthening and accelerating investment in the U.S. semiconductor supply chain ecosystem.


The agreement establishes a collaboration framework for TSMC to procure from Amkor advanced packaging and testing services. By working together as partners to expand capacity, the companies aim to enable a more efficient, mutually beneficial operating model while strengthening their ability to support customers’ evolving requirements.

As demand accelerates for high-performance computing, artificial intelligence, and advanced electronics, advanced packaging has become a critical enabler of system-level performance and integration. Through this collaboration, the advanced semiconductor packaging capacity will increase in the region, achieving faster time to market for end customers.

"We are pleased to enter into this Agreement with our partner Amkor," said Kevin Zhang, senior vice president and deputy Co-COO of TSMC. "We have a long history of experience working with Amkor globally in advanced packaging, and we are confident that our collaboration in the United States will be successful as we look to enhance our capabilities to jointly serve our customers."


The collaboration is expected to enable a more integrated and resilient semiconductor supply chain that benefits customers across a broad range of end markets.

"This Agreement marks an important next step in our partnership with TSMC as we accelerate advanced semiconductor manufacturing in the U.S. to provide our customers a full U.S. supply chain from advanced silicon manufacturing to tested packaged devices," said Kevin Engel, chief executive officer of Amkor Technology.

The partnership reflects a shared commitment to expanding semiconductor manufacturing capabilities, particularly in Arizona. Amkor is progressing its advanced packaging and test campus, while TSMC is developing leading-edge semiconductor fabrication facilities, both located in Arizona. Together, these investments support a stronger semiconductor ecosystem in the United States.

About TSMC

Taiwan Semiconductor Manufacturing Company Limited (TSMC) (NYSE: TSM) is the world’s leading dedicated semiconductor foundry, providing advanced process technologies and manufacturing capabilities to enable innovation across a wide range of industries.

TSMC and Amkor Technology Announce Long Term Partnership to Accelerate Advanced Packaging in the United States

HSINCHU, Taiwan & TEMPE, Ariz., June 16, 2026--Taiwan Semiconductor Manufacturing Company (NYSE: TSM) and Amkor Technology, Inc. (Nasdaq: AMKR) today announced a 10-year agreement to foster a strong partnership that will enhance advanced semiconductor packaging capabilities in Arizona...

sg.finance.yahoo.com

 

[Daniel Nenni]

TSMC breaks cover with a 10-year Amkor packaging deal​

TSMC (2330 TT) and Amkor (AMKR US), the largest US and second-largest global outsourced packaging and test house, signed a 10-year cooperation agreement announced on 16 June US time. This is the first time TSMC has publicly disclosed a 10-year long-term contract with a partner, and industry watchers read it as a push to extend TSMC's "made in America" capacity from wafers into back-end packaging and test.

Under the agreement, TSMC will procure advanced packaging and test services from Amkor, with the two jointly deciding which technologies to deploy, including TSMC's InFO and CoWoS, to meet shared customers' capacity needs. Amkor is building a new plant in Peoria, Arizona, having acquired about 27 hectares of land next to an existing 42-hectare site, with production planned to start in 2028.

The strategic logic is co-location. Amkor's back-end site sits close to TSMC's front-end wafer fabs in Phoenix, which shortens the overall production cycle and removes the need to ship advanced chips back to Asia for packaging. According to Economic Daily News, the supply chain reads this as CoWoS work being routed to Amkor while TSMC's own Arizona packaging fab, AP1, focuses on SoIC.

The read-through runs down Taiwan's packaging suppliers. Substrate maker Unimicron (3037 TT) and equipment names Scientech (3583 TT) and Wanrun are expected to pick up overflow business, and facilities contractor Hantang already booked roughly 56% of 1Q26 revenue in the US. Amkor had earlier flagged its Arizona site would serve NVIDIA, Apple and AMD, and TSMC first announced a deepening of the Amkor relationship in October 2024.

TSMC's first 10-year supplier pact builds a US packaging chain as AI memory tightens — Zero One

18 Jun 2026 — Key signals from AI & semiconductor supply chain intelligence.

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