Register today for 3D Architectures for Semiconductor Integration and Packaging (3D ASIP), December 10-12 at the Hyatt Regency San Francisco Airport Hotel. The full program is available at 3dasip.org and features presentations and preconference symposia spanning the entire 2.5/3D ecosystem, from design through processing and assembly to market applications. With over 30 invited speakers, the conference provides attendees the opportunity to gain important perspectives on topics of high interest to the 2.5/3D community, including:
Speakers at 3D ASIP represent leading companies, universities, and research organizations from around the world. The conference format offers speakers and attendees a unique platform to share and learn the latest insights on industry progress and trends that are shaping the opportunities for today and tomorrow along every point in the global value chain.
Registration is open and early-registration rates are available until November 10. Discounts are also available for corporate groups of two or more, as well as for attendees from government and academia.
Visit the websiteand register today!
See you in San Francisco!
The 3D ASIP Team
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- How can emerging IoT and 2.5/3D systems applications impact future opportunities?
- How are the latest capabilities in design, design tools, standards, and pathfinding providing opportunities for designers to change the paradigm?
- What do the key manufacturing processes and assembly methods and their implementation, as well as costs, mean for the industry?
- How are memory and FPGA devices providing leading-edge product capabilities?
- What are the potential impacts of the expanding developments in what is being referred to as monolithic 3D approaches?
Speakers at 3D ASIP represent leading companies, universities, and research organizations from around the world. The conference format offers speakers and attendees a unique platform to share and learn the latest insights on industry progress and trends that are shaping the opportunities for today and tomorrow along every point in the global value chain.
Registration is open and early-registration rates are available until November 10. Discounts are also available for corporate groups of two or more, as well as for attendees from government and academia.
Visit the websiteand register today!
See you in San Francisco!
The 3D ASIP Team
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