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Intel Embedded Interposer - 2.5D without TSV!

M

msporer

Guest
See page 3 of : Intel Opens Door on 7nm, Foundry | EE Times

This to me is the most significant development of all. Interposer interconnect WITHOUT TSVs! Silicon area a fraction of current interposer solutions. No ultra-thin handling requirements. Available next year. Brilliant!

Looks to be designed for HBM. Or rather HBM is designed for this.

Is this the best kept secret of the decade? Can anyone else offer? Or does Intel have the IP rights locked up?
 
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