The fourth quarter kicks off with two great meetings: 3D-IC Thermal Management and IP Semiconductor Trends. Join us for these very educational and interactive presentations. Share you expertise with industry leaders, collaborate with your peers, contribute to improved product development processes.
3D IC Working Group 10.16.13
Xilinx hosts are we explore Thermal Management techniques. We will review progress of biweekly discussions for ESD and Far-BEOL Best Practices for 3D-IC Packaging. Working group discussion will include 2014 planning.
IP Working Group 10.17.13
Join us at IPextreme as Semico and IPNEST present semiconductor trends. IPNEST looks at the next five years for interface IP, while Semico presents general trends. We will also discuss: 1) An updated and improved IP Licensing Best Practices Survey, and 2) IP Make versus Buy Best Practices.
MOS-AK / GSA Modeling Workshop – 12.11.13
Meetings provide a discussion forum among experts in the field to enhance information exchange related to Compact/Spice Modeling and Verilog-A standardization. Presentations topics cover all important aspects of compact model development, implementation, deployment and standardization.
AMS Working Group 11.13.13
Presentations on Analog / Mixed Signal Verification will precede discussion of Foundry Interoperability.
Supply Chain Working Group 11.14.13
The team discusses Due Diligence checklists to be followed after a merger or acquisition. Updates to Conflict Minerals and 3D-IC impact on Supply Chain will be discussed.
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3D IC Working Group 10.16.13
Xilinx hosts are we explore Thermal Management techniques. We will review progress of biweekly discussions for ESD and Far-BEOL Best Practices for 3D-IC Packaging. Working group discussion will include 2014 planning.
IP Working Group 10.17.13
Join us at IPextreme as Semico and IPNEST present semiconductor trends. IPNEST looks at the next five years for interface IP, while Semico presents general trends. We will also discuss: 1) An updated and improved IP Licensing Best Practices Survey, and 2) IP Make versus Buy Best Practices.
MOS-AK / GSA Modeling Workshop – 12.11.13
Meetings provide a discussion forum among experts in the field to enhance information exchange related to Compact/Spice Modeling and Verilog-A standardization. Presentations topics cover all important aspects of compact model development, implementation, deployment and standardization.
AMS Working Group 11.13.13
Presentations on Analog / Mixed Signal Verification will precede discussion of Foundry Interoperability.
Supply Chain Working Group 11.14.13
The team discusses Due Diligence checklists to be followed after a merger or acquisition. Updates to Conflict Minerals and 3D-IC impact on Supply Chain will be discussed.
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