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I believe that >30% wafer yield is considered ok to move to the production phase for a 20nm or a 14nm device (typically it should be between 30-50%). At 14nm, I do not expect in fact a mature yield much higher than a 70% (of course it also depends on the chip size).
What is binning like with SOCs? It can't be all or nothing--right? Or else, that helps explain the terrible low yields of SOCs--they can't sell slightly off-spec parts.