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In early 2023, Samsung Electronics welcomed former TSMC deputy director Jing-cheng "Vic" Lin to lead an advanced packaging task force to compete against TSMC. However, industry insiders indicate that this task force has recently been disbanded. There are rumors that Chinese wafer fabs are...
www.digitimes.com
Former TSMC executive set to depart Samsung after two years as advanced packaging division restructures
Monica Chen, Hsinchu; Jack Wu, DIGITIMES Asia
Monday 26 August 2024
In early 2023, Samsung Electronics welcomed former TSMC deputy director Jing-cheng "Vic" Lin to lead an advanced packaging task force to compete against TSMC. However, industry insiders indicate that this task force has recently been disbanded.
