Daniel Payne
Moderator
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| valign="middle" | Submit Your Proposal to Speak
at DesignCon 2015
The DesignCon 2015 Call for Technical Papers, Panels and Tutorials is open! DesignCon gives chip, board and systems design engineering community the unique opportunity to gather for four days of learning the latest design techniques, methodologies and tools around SI and PI, high-speed serial design, PCB design tools, test & measurement and more.
Individuals presenting papers at DesignCon will join an elite group offering leading-edge case studies, technology innovations, practical techniques, design tips, and application overviews. This is your chance to share your expertise in the areas of signal and power integrity, test & measurement and verification.
Deadline to submit is July 11, 2014.
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| valign="middle" | SUBMIT PROPOSAL
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The 2015 Topic Categories
The 2015 technical program will consist of 14 tracks covering:
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Who Should Submit?
Past DesignCon speakers have included: Analog Engineers, Application Engineers, CTOs, Design Engineers, Directors of Engineering, Editors, EMC Engineers, Engineering Managers, Fellows, Hardware Engineers, Members of Technical Staff, Principal Engineers, Product Engineers, Professors, R&D Engineers, Signal Integrity Engineers, Systems Engineers, Technical Directors, VPs of Engineering and more.
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How to Submit
Final papers will be due November 10, 2014. We look forward to receiving your submissions, and good luck!
Regards,
Katie Stern
Event Director
DesignCon 2015
|-
[/table]
|-
| valign="middle" | Submit Your Proposal to Speak
at DesignCon 2015
The DesignCon 2015 Call for Technical Papers, Panels and Tutorials is open! DesignCon gives chip, board and systems design engineering community the unique opportunity to gather for four days of learning the latest design techniques, methodologies and tools around SI and PI, high-speed serial design, PCB design tools, test & measurement and more.
Individuals presenting papers at DesignCon will join an elite group offering leading-edge case studies, technology innovations, practical techniques, design tips, and application overviews. This is your chance to share your expertise in the areas of signal and power integrity, test & measurement and verification.
Deadline to submit is July 11, 2014.
[table] style="width: 200.0px"
|-
| valign="middle" | SUBMIT PROPOSAL
|-
[/table]
[table] style="width: 540.0px"
|-
| valign="middle" |
|-
[/table]
The 2015 Topic Categories
The 2015 technical program will consist of 14 tracks covering:
- Optimize Chip-Level Designs for Signal and Power Integrity
- Overcome Analog and Mixed-Signal Modeling and Simulation Challenges
- Wireless and Photonic Integration
- System Co-Design: Chip/Package/Board: Modeling and Simulation
- Characterize PCB Materials and Processing Characterization
- Apply PCB Design Tools
- Design Parallel and Memory Interfaces
- Optimize High-Speed Serial Design
- Detect and Mitigate Jitter, Crosstalk, and Noise
- Leverage High-Speed Signal Processing for Equalization and Coding
- Ensure Power Integrity in Power Distribution Networks
- Achieve Electromagnetic Compatibility and Mitigate Interference
- Apply Test and Measurement Methodology
- Ensure Signal Integrity with RF/Microwave/EM Analysis Techniques
[table] style="width: 200.0px"
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| valign="middle" | LEARN MORE
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[table] style="width: 540.0px"
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| valign="middle" |
|-
[/table]
Who Should Submit?
Past DesignCon speakers have included: Analog Engineers, Application Engineers, CTOs, Design Engineers, Directors of Engineering, Editors, EMC Engineers, Engineering Managers, Fellows, Hardware Engineers, Members of Technical Staff, Principal Engineers, Product Engineers, Professors, R&D Engineers, Signal Integrity Engineers, Systems Engineers, Technical Directors, VPs of Engineering and more.
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How to Submit
- View the instructions on what information is needed to submit
- Read our review criteria on how submissions will be selected
- When you're ready, submit your proposal online
- Deadline to submit: July 11, 2014
Final papers will be due November 10, 2014. We look forward to receiving your submissions, and good luck!
Regards,
Katie Stern
Event Director
DesignCon 2015
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