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3D NAND hits die size milestone (SK Hynix 238 Layers)

Fred Chen

Moderator
SK Hynix's 238 Layer 512 Gb die size is the smallest so far, 35.58 mm2, which is the first time it drops below even DRAM die sizes.


For reference, Samsung 12Gb D1z die size was 43.98 mm2 https://www.signalintegrityjournal.com/articles/2049-inside-samsungs-d1z-lpddr5-dram-with-euvl

12 Gb D1a DRAM sizes are ~37 mm2.

Of course, not all die sizes are larger (such as 8 Gb D1a DRAM), but this is the first time that you have to look for cases which are still smaller.
 
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