Rome - November 5, 2025
Heterogeneous 3D Integration
MZ Technologies today launches a new series of brief, high-impact video tutorials aimed at semiconductor design engineers working with advanced packaging design. The videos can be accessed on GENIOEVOTM web site.
Each video series provides a concise overview of major challenges in system-level 3D-IC development and highlights how the company’s IC/packaging co-design cockpit, GENIOEVOTM, provides effective solutions.
“GENIOEVO simplifies the complexity of designing next-generation 3D-IC,” said Anna Fontanelli, founder and CEO of MZ Technologies. “These videos offer a fast, focused way for engineers and decision-makers to understand the design bottlenecks they face — and how GENIOEVO addresses them.”
Each video starts with a brief introduction, moves into a technical context description, then focuses on a solution overview.
“Our goal is to make the complex accessible and these videos present valuable insights in three minutes,” Ms. Fontanelli explained.
The four-videos cover:
1) Heterogeneous 3D Integration
This first video, available today, introduces 3D-IC heterogeneous systems, where multiple dies with different functions are stacked to boost density and performance. It outlines key challenges, such as multi-physics effects — electrical, thermal, and mechanical — as well as the demand for ultra-dense interconnects. GENIO EVO manages these complexities through integrated tools that streamline design, simulation, and optimization across multiple domains.
2) Multi-Physics Design Cockpit
This second video will be available on November 12, stay tuned.
3) Architectural Exploration and Connectivity Management
This third video will be available on November 19, stay tuned.
4) Advanced Packaging
This fourth video will be available on November 26, stay tuned.
New tutorials spotlight today’s toughest 3D-IC design challenges
Heterogeneous 3D Integration
MZ Technologies today launches a new series of brief, high-impact video tutorials aimed at semiconductor design engineers working with advanced packaging design. The videos can be accessed on GENIOEVOTM web site.
Each video series provides a concise overview of major challenges in system-level 3D-IC development and highlights how the company’s IC/packaging co-design cockpit, GENIOEVOTM, provides effective solutions.
“GENIOEVO simplifies the complexity of designing next-generation 3D-IC,” said Anna Fontanelli, founder and CEO of MZ Technologies. “These videos offer a fast, focused way for engineers and decision-makers to understand the design bottlenecks they face — and how GENIOEVO addresses them.”
Each video starts with a brief introduction, moves into a technical context description, then focuses on a solution overview.
“Our goal is to make the complex accessible and these videos present valuable insights in three minutes,” Ms. Fontanelli explained.
The four-videos cover:
1) Heterogeneous 3D Integration
This first video, available today, introduces 3D-IC heterogeneous systems, where multiple dies with different functions are stacked to boost density and performance. It outlines key challenges, such as multi-physics effects — electrical, thermal, and mechanical — as well as the demand for ultra-dense interconnects. GENIO EVO manages these complexities through integrated tools that streamline design, simulation, and optimization across multiple domains.
2) Multi-Physics Design Cockpit
This second video will be available on November 12, stay tuned.
3) Architectural Exploration and Connectivity Management
This third video will be available on November 19, stay tuned.
4) Advanced Packaging
This fourth video will be available on November 26, stay tuned.