Power and Thermal Analysis of Data Center and Server ICs

Power and Thermal Analysis of Data Center and Server ICs
by Daniel Payne on 08-31-2014 at 4:00 pm

The server market is a diverse, yet standardized market. The ICs and components designed and manufactured in final assemblies must meet form factor requirements for rack mount and blades. The form factor enclosures and the component placement dictate the thermal-mechanical properties and hence the thermal cooling limits … Read More