Tag: webinar
Data Science and Practical AI for Engineers Series: Data Collection, Preparation, and Understanding
Are you an engineer looking to use data science in your day-to-day role?
We’ve brought together some of the brightest minds in this field to show you how it’s done.
As part of this series, we’ll cover:
- Step 1: Data Collection, Preparation, and Understanding
- Step 2: Modeling and Evaluation
- Step 3: Deployment and Visualization
SystemC Evolution Fika
Workshop on the Evolution of SystemC Standards
In 2022 we are continuing the SystemC Evolution by organizing a series of online workshops to discuss the latest SystemC developments and applications. We refer to these workshops as fikas, to honor the fika tradition of sharing a coffee, slowing down a bit, and talking about things… Read More
Synopsys Parasitic Extraction – Interconnect 2022
April 12, 2022
15:30 PM – 18:00 PM UTC +1
Virtual Experience
Why Attend?
Join us at the upcoming SPEX-I 2022 Workshops to learn about the latest features and flows to address signoff parasitic extraction challenges for advanced digital SoC designs or complex custom designs using Synopsys’ StarRC™ solution. In this workshop,… Read More
Formal Verification for Non-Specialists
Overcoming System-Level 3D-IC Electrical and Thermal Challenges
Overview
Electronics products with 3D-ICs face growing system challenges related to signal, power, and thermal integrity. Design density can lead to performance issues caused by heat, crosstalk, and power noise.
Addressing these concerns through simulation during system planning and continuing through signoff will accelerate… Read More
Webinar: Imperas RISC-V simulation technology with eSol Trinity and NSITEXE
Imperas RISC-V reference models highlighted for software development and RISC-V processor verification, including an example project with NSITEXE.
Imperas Software Ltd., the leader in RISC-V simulation solutions, today announced with eSol Trinity the webinar event on RISC-V reference models and simulation technology… Read More
Overcoming System-Level 3D-IC Electrical and Thermal Challenges
Overview
Electronics products with 3D-ICs face growing system challenges related to signal, power, and thermal integrity. Design density can lead to performance issues caused by heat, crosstalk, and power noise.
Addressing these concerns through simulation during system planning and continuing through signoff will accelerate… Read More
Synopsys CAD Navigation Users Group: Avalon™ & SysNav™
Join industry leaders from Intel, Qualcomm, onsemi and Synopsys in the 4th annual, 2nd virtual CAD Navigation (CADNav) User’s Group Meeting as they share the latest innovations, methodologies and experiences using Synopsys CADNav tools, Avalon™ and SysNav™.
You’ll hear about successful deployment of Synopsys CADNAV tools… Read More
3D-IC Chip-Centric Power and Thermal Integrity with High-Performance Hiearchical Analysis
Overview
A 3D-IC includes the package, interposer, multiple chiplets, through-silicon vias (TSVs), and through-dielectric vias (TDVs). Supplying power to the chiplets and dissipating heat through these various components poses a major power integrity (PI) and thermal integrity challenge. Early analysis also is extremely… Read More