Welcome to ITherm 2022
The Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems
May 31 – June 3, 2022
Sheraton Hotel & Marina San Diego, CA USA
(Co-Located with ECTC)
Sponsored by the IEEE’s Electronics Packaging Society (EPS), ITherm 2022 is an international conference… Read More
Overview
Electronics products with 3D-ICs face growing system challenges related to signal, power, and thermal integrity. Design density can lead to performance issues caused by heat, crosstalk, and power noise.
Addressing these concerns through simulation during system planning and continuing through signoff will accelerate… Read More
Overview
Electronics products with 3D-ICs face growing system challenges related to signal, power, and thermal integrity. Design density can lead to performance issues caused by heat, crosstalk, and power noise.
Addressing these concerns through simulation during system planning and continuing through signoff will accelerate… Read More
LIVE WEBINAR | AUGUST 11, 2021 | 11 AM EDT
Performing electronics thermal simulation directly within your CAD system
Most of today’s products include electronics that we can interface with and that control the device. As the use of electronics increases, design engineers are increasingly faced with challenges of thermal management… Read More
LIVE WEBINAR | 07 JULY 2021 | TWO SESSIONS AVAILABLE
In today’s competitive context, telecommunications satellites must accommodate higher payload powers while reducing their mass, volume and cost. It leads to conflicting requirements, such as dissipating higher thermal loads with limited radiative surfaces.
One… Read More
Overview
Join us to fully understand the thermal and stress challenges introduced by 3D-ICs, which are cross-fabric problems. Learn how the Cadence Celsius™ Thermal Solver helps you solve this problem by producing thermal gradient for the whole system, enabling analysis from early design to signoff.
Takeaways:
I remember working at Intel and viewing my first SPICE netlist for a DRAM chip, because there was this temperature statement with a number after it, so being a new college graduate I asked lots of questions, like, “What is that temperature value?”
My co-worker answered, “Oh, that’s the estimated junction… Read More
Power device designers know that when they see a deceptively simple pair of PowerMOS device symbols in the output stage of a power converter circuit schematic, they are actually looking at a massively complex network of silicon and metal interconnect. The corresponding physical devices can have a total device W on the order of … Read More
OK, so maybe the picture here is a little over the top, but thermal and reliability considerations in automotive in general and in ADAS and autonomy in particular, are no joke. Overheating, thermal-induced EM and warping at the board-level, in the package or interposers, are concerns in any environment but especially when you’re… Read More
