Last month Brian Bailey at EDN moderated an interesting webinar about power issues. Unusually, it combined two different domains: doing things by modeling and actually taking measurements off real chips and boards. The two participants were Arvind Shanmugavel from the Apache subsidiary of Ansys, and Randy White from Tektronix.… Read More
Unmanned systems are becoming indispensable to military forces and are used across all of land, sea and air. The generic name for such unmanned systems is UXS, usually UAS (air), UGS (ground) or UUS (underwater). The UAS is the most visible, both due to military strikes and the views of Japan after the Tsunami when areas were unreachable… Read More
Chips, packages and circuit boards (systems, hence CPS) used to be three separate domains with their own tools that barely interacted at all. If you were lucky, reassigning a pin on a package wouldn’t have to be done manually in all 3 places. But now, from a signal integrity, noise, power point of view these three domains must… Read More
3D IC design and what has come to be known as 2½D IC design, with active die on a silicon interposer, require new approaches to verification since the through silicon vias (TSVs) and the fact that several different semiconductor processes may be involved create a new set of design challenges
The power delivery network is a challenge… Read More
The video and slides of the CEDA lunch from a month or two ago are now (finally) up here. Chris Malachowsky presented “Watt’s next.” Chris is one of the founders of nVidia and is currently its senior VP of research. He started by talking a bit about the nVidia product line but moved on to talking about supercomputers… Read More
There are lots of places that Apache is going to popping up in the next few weeks.
Firstly, Andrew Yang will deliver the keynote on October 24th at the Electrical Performance of Electronic Packaging and Systems (EPEPS) in San Jose. He will be talking about “Chip-Package-System convergence: bridging multiple disciplings… Read More
Going up! Power and performance issues, along with manufacturing yield issues, limit how much bigger chips can get in two dimensions. That, and the fact that you can’t manufacture two different processes on the same wafer, mean that we are going up into the third dimension.
The simplest way is what is called package-in-package… Read More
There are a large number of challenges at 20nm that didn’t exist at 45nm or even 32nm.
The biggest issues are in the lithography area. Until now it has been possible to make a reticle using advanced reticle enhacement technology (RET) decoration and have it print. Amazing when you think that at 45nm we are making 45nm features… Read More
Traditionally, David Letterman style, we should really have the top 10 reasons for wasting power in semiconductor design, but here are the five big ones.
Starting with reason #5: Lack of a power gating strategy
Leakage power is a huge proportion of total power and the only way to save leakage power (apart from low leakage cells when… Read More
Last week I met with Andrew Yang, erstwhile CEO of Apache Design Systems and now formally President of Apache Design Inc, a wholly owned subsidiary of ANSYS. The merger formally closed at the start of the month. Within ANSYS Apache is positioned as Chip-aware System-level Engineering Simulation. ANSYS is pretty much completely… Read More
