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Noise & Reliability of FinFET Designs – Success Stories!

Noise & Reliability of FinFET Designs – Success Stories!
by Pawan Fangaria on 11-01-2014 at 7:00 am

I think by now there has been good level of discussion on FinFET technology at sub-20 nm process nodes and this is an answer to ultra dense, high performance, low power, and billion+ gate SoC designs within the same area. However, it comes with some of the key challenges with respect to power, noise and reliability of the design. A FinFET… Read More


Debugging a 10 bit SAR ADC

Debugging a 10 bit SAR ADC
by Daniel Payne on 10-31-2014 at 4:00 pm

SMIC (Semiconductor Manufacturing International Corporation) is a China-based foundry with technology ranging from 0.35 micron to 28 nm, and we’ve blogged about them before on SemiWiki. I’ve been reading about SMIC recently because they created a technical presentation for the MunEDA Technical Forum Shanghai… Read More


GNSS, dead reckoning, and MEMS IMUs

GNSS, dead reckoning, and MEMS IMUs
by Don Dingee on 10-31-2014 at 4:00 pm

GNSS is a wonderful invention, and low cost receivers have crept into smartphones and other mobile devices. However, GNSS does not solve all problems, especially in urban environments. The canyon effect blocks signals at street level between tall buildings, and signals do not penetrate to the interior of parking garages, tunnels,… Read More


Effective Bug Tracking with IP Sub-systems

Effective Bug Tracking with IP Sub-systems
by Daniel Payne on 10-31-2014 at 7:00 am

Designing an SoC sounds way more exciting than bug tracking, but let’s face it – any bug has the potential to make your silicon fail, so we need to take a serious look at the approaches to bug tracking. When using an IP or an IP subsystem in a design, the SoC integrators require some critical knowledge about this IP. The actual… Read More


Silvaco at the TSMC 2014 Open Innovation Platform

Silvaco at the TSMC 2014 Open Innovation Platform
by Daniel Payne on 10-31-2014 at 7:00 am

The success of our semiconductor eco-system depends on collaboration, so the annual TSMC OIP Event just held on September 30 at the San Jose Convention Center was a prime example of that. I didn’t attend this year, but I did follow up with Amit Nandaof Silvaco this week to hear about what they presented. As a consultant I’ve… Read More


Improving Verification by Combining Emulation with ABV

Improving Verification by Combining Emulation with ABV
by Tom Simon on 10-30-2014 at 4:00 pm

Chip deadlines and the time to achieve sufficient verification coverage run continuously in a tight loop like a dog chasing its tail. Naturally it is exciting when innovative technologies can be combined so that verification can gain an advantage. Software based design simulators have been the mainstay of verification methodologies.… Read More


Microprocessors: Will ARM Rule the World?

Microprocessors: Will ARM Rule the World?
by Paul McLellan on 10-30-2014 at 12:00 pm

Last week was the Linley Microprocessor Conference. Not the mobile one, which I find the most interesting since smartphones are such a bit part of what drives process technology these days, this is the one focused on networking and servers. But increasingly both markets are being driven by the same thing, namely mobile data. In … Read More


Adding a Digital Block to an Analog Design

Adding a Digital Block to an Analog Design
by Daniel Payne on 10-30-2014 at 7:00 am

My engineering background includes designing at the transistor-level, so I was drawn to attend a webinar today presented by Tanner EDAand Incentia about Adding a Digital Block to an Analog Design. Many of the 30,000 users of Tanner tools have been doing AMS designs, so adding logic synthesis and static timing analysis from IncentiaRead More


Viva the New Industrial Revolution! What Etsy, 3D Printing, and Kickstarter Means to Semiconductor Companies?

Viva the New Industrial Revolution! What Etsy, 3D Printing, and Kickstarter Means to Semiconductor Companies?
by Charles DiLisio on 10-29-2014 at 4:00 pm

The world is changing and IC companies need to adapt to this to stay competitive — moving to systems (hardware and software) vs. just product (hardware). Three key trends that are underway that change the way IC vendors need to think about their customer and the customer’s customer:

  • Markets are Fragmenting: We are moving away from
Read More

Cadence Mixed Signal Technology Forum

Cadence Mixed Signal Technology Forum
by Paul McLellan on 10-29-2014 at 7:00 am

Yesterday was Cadence’s annual mixed-signal technology forum. I think that there was a definite theme running through many of the presentations, namely that wireless communication of one kind or another is on a sharp rise with more and more devices needing to connect to WiFi, Bluetooth and so on. This was most obvious during… Read More