This press release from CAST announces a significant collaboration with RANiX Inc., highlighting the integration of CAST’s TSN Switch IP core into RANiX’s new Integrated Micro Flat Antenna System (IMFAS) SoC. This development underscores the growing adoption of Time-Sensitive Networking (TSN) in the automotive… Read More
Posts Search Results for "ISO 26262"
The Critical Role of Pre-Silicon Security Verification with Secure-IC’s Laboryzr™ Platform
As embedded systems and System-on-Chip (SoC) designs grow in complexity and integration, the risk of physical attacks has dramatically increased. Modern day adversaries no longer rely solely on software vulnerabilities; instead, they exploit the physical properties of silicon to gain access to sensitive data. Side-channel… Read More
The Future of Mobility: Insights from Steve Greenfield
On July 18, 2025, Steve Greenfield, an early-stage investor and author, delivered a compelling 45-minute talk at DACtv on the future of mobility. Quoting futurist William Gibson—“The future is already here. It’s just not evenly distributed”—Greenfield explored how emerging technologies and business models are reshaping… Read More
Modern Data Management: Overcoming Bottlenecks in Semiconductor Engineering
In a DACtv session on July 9, 2025, Pedro Pires from Keysight’s Design Engineering Software addressed the critical role of data management in modern semiconductor engineering projects. The presentation highlighted why data has become a bottleneck, how Keysight’s SOS (Save Our Source) platform mitigates these challenges,… Read More
Security Coverage: Assuring Comprehensive Security in Hardware Design
As hardware systems become increasingly complex and security threats grow more sophisticated, ensuring robust hardware security during the pre-silicon phase of development is more critical than ever. Cycuity’s white paper outlines how its Radix platform enables engineers to verify, visualize, and measure the effectiveness… Read More
Memory Innovation at the Edge: Power Efficiency Meets Green Manufacturing
By Tetsu Ho
With the ever-increasing global demand for smarter, faster electronic systems, the semiconductor industry faces a dual challenge: delivering high-performance memory while reducing environmental impact. Winbond is meeting this challenge head-on by embedding sustainability into every layer of its operations—from… Read More
New Cooling Strategies for Future Computing
Power densities on chips increased from 50-100 W/cm2 in 2010 to 200 W/cm2 in 2020, creating a significant challenge in removing and spreading heat to ensure reliable chip operation. The DAC 2025 panel discussion on new cooling strategies for future computing featured experts from NVIDIA Research, Cadence, ESL/EPFL, the University… Read More
Arteris at the 2025 Design Automation Conference #62DAC
Key Takeaways:
- Expanded Multi-Die Solution: Arteris showcases its foundational technology for rapid chiplet-based innovation. Check out the multi-die highlights video.
- Ecosystem compatibility: Supported through integration with products from major EDA and foundry partners, including Cadence, Synopsys, and global
Secure-IC at the 2025 Design Automation Conference #62DAC
Secure-IC at DAC 2025: Building Trust into Tomorrow’s Chips and Systems
As semiconductor innovation accelerates, the chiplet-based design paradigm is redefining the landscape of advanced electronic systems. At DAC 2025, Secure-IC (booth #1208) will present a comprehensive suite of technologies engineered to address the… Read More
Mixel at the 2025 Design Automation Conference #62DAC
Mixel, Inc., a leading provider of mixed-signal interface IP, will exhibit at booth #2616 at Design Automation Conference (DAC) 2025 on June 23-25. The company will demonstrate its latest customer demos featuring Mixel’s MIPI PHY IP and LVDS IP. Mixel’s customers include many of the world’s largest semiconductors and system… Read More









Semidynamics Unveils 3nm AI Inference Silicon and Full-Stack Systems