Ocotillo Technology Fabrication Dry Etch Process Engineer

As an Intel Ocotillo Technology Fabrication Dry Etch Process Engineer, you’ll join a team helping to develop the most efficient means for semiconductor manufacturing, enabling microprocessors to yield higher and be manufactured more affordably. Process engineers, along with yield and equipment engineers, take responsibility for monitoring and controlling wafer fabrication and product performance including managing tool productivity and maintenance, conducting data analysis to improve processes, and managing quality control points to target. A process engineer has responsibilities that touch multiple pillars within the department including safety, quality, cost, output and cycle time, training, and productivity – driving systematic improvements in each of these vectors. A process engineer is expected to support segment team activities to enable parametric and defectivity matching on the product and improvement across different sectors of the process flow. A process engineer may also be responsible for supporting cross-functional and cross-department activities to enable parametric and defectivity matching and improvement. In addition to driving results in these spaces, a process engineer is expected to be a role model for the culture and set the standard for expectations to living the culture. Training, development, and mentoring of junior engineers is also an expectation as we develop the team for future challenges.

Responsibilities may include:

• Ensuring sufficient safety and cleanliness of your area and ensuring copy exactly matching of equipment configuration, parameters, and targeting to the standard
• Regular review of metrics related to your tool and area’s quality output
• Driving continuous improvement in the health and matching of your toolset by developing, maintaining, and executing an improvement roadmap across all the different factory pillars
• Applying model-based problem solving to identify root cause of tool or process mismatches from target, and then developing solutions to problems utilizing formal education and judgment
• Conducting tests and measurements to determine control over such variables as gas flow, chamber pressure, rf and/or microwave power and temperature influences on wafer processing
• For new technology start-ups, managing tool installations, conversions, and qualifications plus delivering sigma matched performance on critical silicon
• Mentoring technicians and junior engineers across all shifts to deliver best-in-class results for path availability, cycle time, defects and parametric performance
• Ability to develop improved quality and yield sustaining systems for engineering teams based on strong understanding of multivariate process interactions.

The ideal candidate should have a subset of the following traits:

• Technical expertise on Dry Etch platforms and be able to provide technical direction on Dry Etch quality issues, Dry Etch matching performance and Dry Etch yield improvement.
• Expertise with Dry Etch plasma generation and control.
• Knowledge of common etch chemistries used to etch different films and the physical and chemical reactions.
• Expert understanding of the critical dimension metrology used for measuring patterning performance including its dependence on dry etch parameters.
• Expertise troubleshooting Dry Etch equipment including gas systems, power system and vacuum systems.
• Clear understanding of how Dry Etch is used in the overall chip building process and common interactions with upstream and downstream operations.
• Expertise with troubleshooting inline integrated defect sources and developing root cause solutions at the tool level.
• Demonstrated capability of working in a high performing team culture which includes: setting high expectations, driving accountability to those expectations with a high sense of urgency, role modeling the desired culture, possess excellent teamwork and leadership skills, demonstrated problem solving and prioritization skills, and driving high performance maintenance goals for the group.
• Ability to use data to influence factory and virtual factory direction.
• Ability to lead technical teams.
• Excellent listening, written and verbal communication, an ability to deal with ambiguity in defining activities and direction, and commitment to task.
• Ability to work independently and manage stakeholders.
• Capable of articulating data and projects to senior management.
• High motivation with a strong work ethic.
• Analytical mind with problem solving skills.
• Ability to influence change across the virtual factory networks.

Qualifications

Minimum qualifications are required to be initially considered for this position. Preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates.

Minimum requirements:

• Candidate must possess at a minimum a Bachelor of Science Degree in a related science or engineering
• Ideal candidate will have a Bachelor of Science Degree and minimum of 9 years of Dry Etch experience, a Masters of Science Degree and minimum of 7 years Dry Etch experience or a PhD in related science or engineer field and a minimum of 5 years Dry Etch experience in any of the following :
  • Process flow, equipment troubleshooting.
  • Interacting with vendor field service engineering support and manufacturing/engineering technicians on toolsets.
  • Providing technical direction on quality issues.
  • Advanced data analysis.
  • Principles of plasma processes, dry etch and basic RF and Microwave knowledge.
  • Knowledge of plasma-etch equipment, including recipe development and defect troubleshooting techniques
  • Technical expertise on plasma/surface interactions, dry-etch chemistries, RIE and ICP etching, atomic-layer-etching.
• 1+ years’ Experience leading technical teams to achieve a specific result providing both technical expertise and overall direction to the team.

Preferred Qualifications:

• Technical expertise within Semiconductor Processing Engineering and be able to provide technical direction on Dry Etch quality issues, Dry Etch matching performance and Dry Etch yield improvement.
• Understanding of Dry Etch manufacturing process steps and ability to understand interactions with incoming and outgoing process modules.
• Knowledge of Manufacturing science, Capacity Metrics, In-line and EOL defect and excursion prevention/response
• Experience in leading senior, cross function/cross organization teams
• Experience in Data analysis (JMP, SPC, MATLAB, Mathematica) and Design of Experiment (DOE) principles
• Previous or current Intel OTF Process Engineering experience, and knowledge of Intel OTF systems and processes will be considered a plus factor when evaluating candidates for this position.
• Having a strong working relationship with Portland Technology and Development (PTD) is considered a plus.