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Advanced Packaging Material Development Manager

Advanced Packaging Material Development Manager
by Admin on 04-28-2022 at 3:15 pm

Website TSMC

Description

 

1. Develop advanced material technology for 3DFabric advanced package
2. Lead the team to collaborate with internal and external stakeholders for new material development and production introduction.
3. Identify potential advanced package product/process issues in new material development phase
4. Verify new materials properties characterization and production feasibility, including machine suitability, process window, key COA, and line monitor.
5. Collaborate with external laboratories, institutes, and vendors for development and production activity of new package materials.

 

Qualifications

 

1. Deep knowledge of electrical, mechanical, and thermal properties of 3DIC advanced package materials, such as molding compound, underfill, adhesion, and TIM
2. Familiarity with 3DIC advanced package materials production process
3. Experience in advanced package development or production
4. Capability to do R&D projects independently while being able to collaborate with cross-functional teams.
5. Excellent communication, project management and leadership skills
6. Master’s degree or Ph.D. in Materials Science, Chemical Engineering, or relevant fields
7. 10+ years of experiences in semiconductor industry
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