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During TSMC’s earnings conference call in January 2026, TSMC CFO Wendell Huang stated that advanced packaging revenue contributed approximately 10% of TSMC’s 2025 revenue of US$122.42 billion.
"Wendell Huang - Taiwan Semiconductor Manufacturing Co Ltd - Senior Vice President, Finance and Chief Financial Officer / Spokesperson
Okay, Laura, the revenue contribution last year from advanced packaging is slightly over 10% (corrected by company after the call). It's about 8% in 2024. We expect it to grow faster than the corporate average, and account for low-teens % in 2026. (corrected by company after the call)
And the CapEx, yes, you are right, in the past, it's about 10%, lower than 10%. Now we're saying advanced packaging together with mask-making and others, accounted for between 10% to 20%. So you can see that, the investment, amount is higher."
TSMC didn't report packaging until 2025 which was slightly over 10%. Prior to that it was 5-9% from what I heard. 2026 will be a breakout year. TSMC has 7 packaging plants in operation with four more on the way. Two of those are in Arizona.
CoWoS® (Chip-on-Wafer-on-Substrate) is a 2.5D advanced packaging technology developed by TSMC that allows multiple dies—including logic, memory, and analog ICs—to be integrated side-by-side on a high-density silicon interposer. CoWoS is a cornerstone of TSMC’s 3D Fabric™ platform and plays a...
CoWoS-S and CoWoS-R are two versions of TSMC’s Chip-on-Wafer-on-Substrate advanced packaging platform. Both technologies are designed to combine high-performance processors, chiplets and high-bandwidth memory, or HBM, within a single package. This shortens the electrical connections between...
There has been talk at the latest conferences about TSMC customers taking wafers to Intel for packaging. The question is why? Is it competitive pricing? Capacity? Supply chain diversity? CC Wei was asked about this during the last investor call and his perfect response was: Jeff Su: I guess very...