Array
(
    [content] => 
    [params] => Array
        (
            [0] => /forum/search/669144/?c%5Busers%5D=Daniel+Nenni&o=date
        )

    [addOns] => Array
        (
            [DL6/MLTP] => 13
            [Hampel/TimeZoneDebug] => 1000070
            [SV/ChangePostDate] => 2010200
            [SemiWiki/EmailDomainReplace] => 1000010
            [SemiWiki/Newsletter] => 1000010
            [SemiWiki/WPMenu] => 1000010
            [SemiWiki/XPressExtend] => 1000010
            [ThemeHouse/XLink] => 1000970
            [ThemeHouse/XPress] => 1010570
            [XF] => 2031070
            [XFI] => 1060170
        )

    [wordpress] => /var/www/html
)

Search results

  1. Daniel Nenni

    Japan’s Rapidus Takes on TSMC With Aggressive 2nm Pricing

    I met with Rapidus last year after Hot Chips. They were pitching faster turn around time than TSMC. No mention of pricing. My suggestion was get a couple of trusted customers, like TSMC has with: Nvidia, Apple, Nvidia, QCOM, etc... and co develop and customize the process. I also wonder...
  2. Daniel Nenni

    Japan’s Rapidus Takes on TSMC With Aggressive 2nm Pricing

    The race for advanced nodes among foundries is shifting beyond a battle over technology timelines, with emerging challengers also competing on pricing. According to Nikkei, Rapidus, which is targeting 2nm mass production in 2027, plans to price its foundry services at levels comparable to or...
  3. Daniel Nenni

    TSMC's Moat Revealed: 93,000 Certified IPs Build a Hundred-Billion-Dollar Ecosystem Barrier

    Without a doubt. There is also the experienced gained by working with the top EDA and IP companies. This has been 30 years in the making and cannot be replicated.
  4. Daniel Nenni

    TSMC's Moat Revealed: 93,000 Certified IPs Build a Hundred-Billion-Dollar Ecosystem Barrier

    Semiconductor research firm SemiAnalysis has released a disruptive perspective, arguing that TSMC's most difficult-to-replicate moat is not its advanced process technology or EUV equipment, but rather the EDA and IP ecosystem it has spent over a decade building. Through its Open Innovation...
  5. Daniel Nenni

    Thermal Management Challenges in Chiplet-based Architectures

    Chiplet-based HPC and AI packages impose much tighter thermo-mechanical constraints than monolithic designs. In 2.5D and 3D stacks, localized heat flux can create steep temperature gradients, causing differential expansion between silicon, interposers, substrates, underfills, and thermal...
  6. Daniel Nenni

    Taiwanese chipmaker Nanya plans $6 billion in spending in 2027, riding AI boom

    - Projected 2027 spending is four times this year's total - AI revolution driving up memory chip demand - Nanya customers include Google, Nvidia, Qualcomm TAIPEI, July 10 (Reuters) - Taiwanese memory chipmaker Nanya Technology (2408.TW), opens new tab said on Friday it plans capital spending...
  7. Daniel Nenni

    Meta to put AI chip into production in September as it looks to double computing capacity, memo shows

    Meta Platforms plans to begin producing a new in-house artificial intelligence chip in September, a move that underscores how aggressively the company is racing to expand its AI infrastructure. According to a Reuters report citing an internal memo, the chip is code-named Iris and is part of...
  8. Daniel Nenni

    How TSMC Will Surpass 2nm and Other Insights from New IMEC CEO

    In April, IMEC's newly installed CEO moved quickly to bring together executives from TSMC, Nvidia, Samsung, ASML, and other major players in Belgium. How is IMEC, the semiconductor R&D hub inseparable from ASML, using 3D stacking and next-generation lithography tools to keep pace with a...
  9. Daniel Nenni

    Major AI models at a glance By Reuters

    July 8 (Reuters) - OpenAI will launch GPT-5.6, its most advanced AI model, on Thursday after a delay prompted by U.S. government concerns over the potential national security risks posed by increasingly powerful AI systems. The release comes amid intensifying competition among AI developers who...
  10. Daniel Nenni

    Apple to spend $30 billion on Broadcom chips as it boosts US sourcing

    Apple’s planned $30 billion-plus chip-supply agreement with Broadcom marks a significant step in the company’s effort to localize more of its semiconductor supply chain in the United States. According to Reuters, the multi-year deal extends through 2031 and centers on U.S.-made wireless and...
  11. Daniel Nenni

    Analysis: AI supercycle could drive semiconductor market beyond US$2 trillion by 2030

    My question is how much of the $2T is pricing versus unit count? If we are just raising pricing then that is not real progress. That just means a select few companies (memory) are getting rich while the rest are living paycheck to paycheck. Kind of like the economy in the USA. :ROFLMAO:
  12. Daniel Nenni

    Analysis: AI supercycle could drive semiconductor market beyond US$2 trillion by 2030

    The AI supercycle is reshaping semiconductor demand from a cyclical, consumer-led model into an infrastructure-driven growth phase. Digitimes’ view that the market could exceed US$2 trillion by 2030 reflects the rapid expansion of AI computing, where demand is no longer limited to CPUs and...
  13. Daniel Nenni

    25 Essential Thought Leaders in Semiconductors

    Why Semiconductor Thought Leadership Matters Right Now The semiconductor industry is not just another sector of the global economy. Approximately 1.05 trillion chips were sold globally in 2025 at an average price of US$0.74 per chip, according to Deloitte's 2026 outlook. Building a single...
  14. Daniel Nenni

    Why CPUs Are Now at the Center of the AI Race

    Why did we not see this coming? I bet ChatGPT knew. :ROFLMAO:
  15. Daniel Nenni

    Reflections on the Cost Bottlenecks of Advanced Packaging in the Next Three Years: Is Chiplet Truly the Silver Bullet?

    Advanced packaging is often presented as the next frontier for semiconductor innovation, especially as traditional Moore’s Law scaling becomes more expensive and technically difficult. Over the next three years, however, the industry will likely face significant cost bottlenecks that make...
  16. Daniel Nenni

    Why CPUs Are Now at the Center of the AI Race

    US chipmakers lead, but China players aim to increase local market share The AI hardware race is shifting beyond GPUs. While graphics processors remain essential for dense tensor computation, CPUs are becoming strategic because modern AI systems are increasingly heterogeneous, distributed and...
  17. Daniel Nenni

    Intel Solves 18A Yield Issues, Production Reaches 30,000 Wafers Per Month

    Absolutely! I will pass the word. Any other questions that should be asked? Anyone? I will make a list.
  18. Daniel Nenni

    China's DeepSeek developing its own AI chip, sources say

    DeepSeek’s reported move to develop its own AI chip marks a significant step toward vertical integration in China’s AI stack. According to Reuters, the company is designing an AI chip that could reduce its dependence on Nvidia and Huawei processors, with the effort reportedly focused on...
  19. Daniel Nenni

    Intel Solves 18A Yield Issues, Production Reaches 30,000 Wafers Per Month

    Actually it is higher than that which is the problem with yield. By the time you publish a number it is obsolete. GO INTEL! The Yield Partnership: Intel and PDF Solutions Tackle Advanced Nodes Key takeaways▼ Intel 18A success hinges on yield improvement to restore confidence and advance...
  20. Daniel Nenni

    Intel Solves 18A Yield Issues, Production Reaches 30,000 Wafers Per Month

    Intel has reportedly resolved all yield issues it experienced with its 18A node over the past few months. According to the sell-side equity research firm BlueFin Research Partners, Intel has fixed these yield issues, making the high-volume production of its latest node sustainable from both a...
Back
Top