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Array
(
    [content] => 
    [params] => Array
        (
            [0] => /forum/search/319061/?c%5Busers%5D=Fred+Chen&o=date&page=5
        )

    [addOns] => Array
        (
            [DL6/MLTP] => 13
            [Hampel/TimeZoneDebug] => 1000070
            [SV/ChangePostDate] => 2010200
            [SemiWiki/Newsletter] => 1000010
            [SemiWiki/WPMenu] => 1000010
            [SemiWiki/XPressExtend] => 1000010
            [ThemeHouse/XLink] => 1000970
            [ThemeHouse/XPress] => 1010570
            [XF] => 2030770
            [XFI] => 1060170
        )

    [wordpress] => /var/www/html
)

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  1. F

    Intel stock pops on news company is in early talks to add AMD as a customer

    6 months ago, AMD announced it was TSMC N2 first HPC customer and also a customer for TSMC Arizona: https://www.amd.com/en/newsroom/press-releases/2025-4-14-amd-achieves-first-tsmc-n2-product-silicon-milesto.html But AMD CEO Lisa Su also mentioned that TSMC Arizona is 5%-20% more expensive than...
  2. F

    Tech U.S. Commerce head Lutnick wants Taiwan to help America make 50% of its chips locally

    It might be moot if TSMC USA takes the load.
  3. F

    The three major memory powerhouses are investing in 1c DRAM, targeting the AI and HBM markets

    Yes, GAA is one option. Also actual word line on one side or both. Also one side might be a differently biased back gate.
  4. F

    The three major memory powerhouses are investing in 1c DRAM, targeting the AI and HBM markets

    The 4F2 vertical channel scheme is still continued scaling of bit line pitch (which increases its capacitance relative to capacitor) but the slanted active area pattern is gone, and the buried word line now becomes a side word line. It is projected to only be used for three years (three nodes)...
  5. F

    The three major memory powerhouses are investing in 1c DRAM, targeting the AI and HBM markets

    Main issue right now is they can't get enough layers (>100).
  6. F

    Intel splashes more cash on ASML’s magic machines

    I was looking over some of Intel's recent SPIE papers from within the past year. ASML/Zeiss can't measure the High-NA EUV system aberrations at their own site (too big), they have to do so at the customer site. That means all High-NA systems are basically shipped out of spec, and one or more...
  7. F

    The three major memory powerhouses are investing in 1c DRAM, targeting the AI and HBM markets

    The thinning of the dielectric between bit line and storage node contact results in rapidly growing parasitic capacitances and leakage. So this is the problem with current planar 6F2 DRAM. 4F2 DRAM offers a way out but capacitor patterning is still a problem and more than one stacked layer is...
  8. F

    The three major memory powerhouses are investing in 1c DRAM, targeting the AI and HBM markets

    The three companies have taken different paths, not just in EUV deployment. The shrink from 1a to 1b (14nm to 12nm) is larger than from 1b to 1c (12nm to 11nm). So the EUV is not a big help in this regard.
  9. F

    Intel splashes more cash on ASML’s magic machines

    IIRC N7 DUV process used 4P4E while N7+/N6 used 1P1E. But it's a big misunderstanding to equalize the cost and yield of DUV 1P1E and EUV 1P1E.
  10. F

    Intel splashes more cash on ASML’s magic machines

    There's some more on the differences among the N7 processes here: https://www.eettaiwan.com/20200115nt61-7nm-comparision/ although N6 was not out yet it seems. But there's actually an N7P different from N7+.
  11. F

    Intel splashes more cash on ASML’s magic machines

    I just checked TSMC's site now, it seems to be consistent with as you say: https://www.tsmc.com/english/dedicatedFoundry/technology/logic/l_5nm In 2020, TSMC became the first foundry to move 5nm FinFET (N5) technology into volume production and enabled customers’ innovations in smartphone and...
  12. F

    Quantum Computer built with standard chips

    It's based on a cryogenic spintronic device. IMEC had been fabricating the chips for them. It looks like electron-beam lithography is still being used on these demo chips. I think it's because the volume is not enough to justify making a set of masks.
  13. F

    The three major memory powerhouses are investing in 1c DRAM, targeting the AI and HBM markets

    Actually, for these three companies, 1c is less than a 10% shrink in design rule from 1b. So, like SRAM, planar DRAM has effectively stopped scaling.
  14. F

    The three major memory powerhouses are investing in 1c DRAM, targeting the AI and HBM markets

    36 nm center-to-center capacitors are difficult to pattern.
  15. F

    The three major memory powerhouses are investing in 1c DRAM, targeting the AI and HBM markets

    Major memory companies are accelerating their investments in 1c (6th-generation 10nm-class) DRAM. Samsung Electronics has already begun building mass production lines since the first half of this year, and SK Hynix is reportedly discussing specific plans for its recent conversion investment...
  16. F

    Intel approaches TSMC for investments or partnership, WSJ reports

    It's not just the money to spend. You have to have all the equipment vendors like ASML only supply Intel for a good year or two just to get it to be able to support the capacity comparable to TSMC.
  17. F

    Intel approaches TSMC for investments or partnership, WSJ reports

    Building fabs in US has been difficult for a while, even Intel scattered itself. It's worse now.
  18. F

    Intel approaches TSMC for investments or partnership, WSJ reports

    A Chinese invasion of Taiwan is always good to hype.
  19. F

    Poll: Half of Taiwan fears TSMC becoming US-SMC

    It's already a big task to manage TSMC's IP based in Taiwan: https://www.reuters.com/world/asia-pacific/tsmc-market-system-manage-trade-secrets-its-lawyer-says-2025-08-29/
  20. F

    Poll: Half of Taiwan fears TSMC becoming US-SMC

    Continuing from the same article: The move is also heavily influenced by commercial and economic factors. TSMC’s most significant clients are predominantly American technology companies, including NVIDIA, Apple, Broadcom, and AMD, all of which rely on sourcing the most advanced semiconductor...
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