You are currently viewing SemiWiki as a guest which gives you limited access to the site. To view blog comments and experience other SemiWiki features you must be a registered member. Registration is fast, simple, and absolutely free so please, join our community today!
By Zhiye Liu published 2 days ago
So, should we call this 10th Gen or Core Series 1?
It appears that Intel is experiencing a sense of nostalgia, as the chipmaker (via momomo_us) has introduced the Core i5-110 processor, based on Comet Lake. Comet Lake is a stroll down memory lane for many of...
This didn't age well: https://investor.synopsys.com/news/news-details/2025/Synopsys-and-Intel-Foundry-Propel-Angstrom-Scale-Chip-Designs-on-Intel-18A-and-Intel-18A-P-Technologies/default.aspx
Mitsui Chemicals licensed technology from ASML and IMEC to produce EUV pellicles which they sell. Samsung and TSMC have published their ongoing evaluation efforts. TSMC has gone so far to set up its own EUV pellicle infrastructure in preparation for producing its own pellicles for its own use...
Very unclear article source: https://www.etnews.com/20250910000245
However, it remains unclear whether Intel will procure glass substrates in-house or through external collaboration. Mass production requires significant investment, and multiple manufacturers are needed to ensure a stable...
I found an interesting excerpt from here: https://globaltechresearch.substack.com/p/carbon-nanotube-cnt-the-next-big
Not only do memory manufacturers not use EUV pellicles, but even TSMC tries not to use EUV pellicles too much in their advanced node process, due to their high cost (over $10,000...
Since there will be many layers (like in 3D NAND), the capacitors can be spaced further apart, not requiring the highest resolution anymore.
The issue with 4-6 F^2 is that distances between different features that can couple capacitively are getting too close.
For 4F^2, there is the additional...
Without pellicles, periodic inspections are needed to infer particles on the mask before too many dies are lost. The inspection cost could force some yield risk to be accepted. https://www.researchgate.net/publication/331763063_Advanced_particle_contamination_control_in_EUV_scanners
JY Han 승인 2025.09.03 07:35
Supply could start within year
FST was holding talks with Samsung on the price of extreme ultraviolet (EUV) pellicles that it will supply to the South Korean chipmaker, TheElec has learned.
The back and forth on the price of the commodity used in advanced chips...
SK Hynix should be worried about what's really limiting DRAM scaling.
As I've said here: https://semiwiki.com/forum/threads/sk-hynix-presents-future-dram-technology-roadmap-at-ieee-vlsi-2025.23427/#post-90937
6F² scaling is now coming up against the issue of shrinking gap between bit line and...
The Chinese semiconductor industry's commitment to and pursuit of HBM (High Bandwidth Memory) development is strong. Yangtze Memory Technology (YMTC), a major local NAND manufacturer, is also reportedly conducting research and development on DRAM and seeking collaborations with major local DRAM...
TOKYO, Aug. 26, 2025 — Rapidus Corporation, a leading-edge Japanese foundry that manufactures advanced logic semiconductors, today announced a strategic collaboration with Keysight Technologies Japan K.K., the Japanese subsidiary of Keysight Technologies, Inc., and has signed a Memorandum of...
