Newest 5nm Enhancement Tailored for High Performance Computing Products
HSINCHU, Taiwan, R.O.C., Dec. 16, 2021 – TSMC (TWSE: 2330, NYSE: TSM) today introduced its N4X process technology, tailored for the demanding workloads of high performance computing (HPC) products. N4X is the first of TSMC’s HPC-focused technology offerings, representing ultimate performance and maximum clock frequencies in the 5-nanometer family. The “X” designation is reserved for TSMC technologies that are developed specifically for HPC products.
Leveraging its experience in 5nm volume production, TSMC further enhanced its technology with features ideal for high performance computing products to create N4X. These features include:
“HPC is now TSMC’s fastest-growing business segment and we are proud to introduce N4X, the first in the ‘X’ lineage of our extreme performance semiconductor technologies” said Dr. Kevin Zhang, senior vice president of Business Development at TSMC. “The demands of the HPC segment are unrelenting, and TSMC has not only tailored our ‘X’ semiconductor technologies to unleash ultimate performance but has also combined it with our 3DFabric™ advanced packaging technologies to offer the best HPC platform.”
TSMC’s HPC platform not only offers performance-optimized silicon with N4X technology, but also provides the greatest design flexibility with its comprehensive 3DFabric™ advanced packaging technologies and a broad design enablement platform with our ecosystem partners through the TSMC Open Innovation Platform®.
For more information on the N4X process, please visit https://performance.tsmc.com
Vice President & Chief Financial Officer
Tel:886-3-5055901
Public Relations Department
Tel:886-3-5636688 Ext.7125036
HSINCHU, Taiwan, R.O.C., Dec. 16, 2021 – TSMC (TWSE: 2330, NYSE: TSM) today introduced its N4X process technology, tailored for the demanding workloads of high performance computing (HPC) products. N4X is the first of TSMC’s HPC-focused technology offerings, representing ultimate performance and maximum clock frequencies in the 5-nanometer family. The “X” designation is reserved for TSMC technologies that are developed specifically for HPC products.
Leveraging its experience in 5nm volume production, TSMC further enhanced its technology with features ideal for high performance computing products to create N4X. These features include:
- Device design and structures optimized for high drive current and maximum frequency
- Back-end metal stack optimization for high-performance designs
- Super high density metal-insulator-metal capacitors for robust power delivery under extreme performance loads
“HPC is now TSMC’s fastest-growing business segment and we are proud to introduce N4X, the first in the ‘X’ lineage of our extreme performance semiconductor technologies” said Dr. Kevin Zhang, senior vice president of Business Development at TSMC. “The demands of the HPC segment are unrelenting, and TSMC has not only tailored our ‘X’ semiconductor technologies to unleash ultimate performance but has also combined it with our 3DFabric™ advanced packaging technologies to offer the best HPC platform.”
TSMC’s HPC platform not only offers performance-optimized silicon with N4X technology, but also provides the greatest design flexibility with its comprehensive 3DFabric™ advanced packaging technologies and a broad design enablement platform with our ecosystem partners through the TSMC Open Innovation Platform®.
For more information on the N4X process, please visit https://performance.tsmc.com
TSMC Spokesperson
Wendell HuangVice President & Chief Financial Officer
Tel:886-3-5055901
TSMC Deputy Spokesperson
Nina KaoPublic Relations Department
Tel:886-3-5636688 Ext.7125036