PHOENIX, Arizona, Dec. 6, 2022 – TSMC (TWSE: 2330, NYSE: TSM) today announced that
in addition to TSMC Arizona’s first fab, which is scheduled to begin production of N4 process
technology in 2024, TSMC has also started the construction of a second fab which is scheduled to
begin production of 3nm process technology in 2026. The overall investment for these two fabs
will be approximately US$40 billion, representing the largest foreign direct investment in Arizona
history and one of the largest foreign direct investments in the history of the United States.
In addition to the over 10,000 construction workers who helped with construction of the site,
TSMC Arizona’s two fabs are expected to create an additional 10,000 high-paying high-tech jobs,
including 4,500 direct TSMC jobs. When complete, TSMC Arizona’s two fabs will manufacture
over 600,000 wafers per year, with estimated end-product value of more than US$40 billion.
In line with TSMC’s commitment to green manufacturing, it was also revealed that TSMC Arizona
is in the planning stages for an on-site Industrial Water Reclamation Plant that when finished, will
allow the TSMC Arizona site to achieve near zero liquid discharge.
“When complete, TSMC Arizona will be the greenest semiconductor manufacturing facility in the
United States producing the most advanced semiconductor process technology in the country,
enabling next generation high-performance and low-power computing products for years to come,”
said TSMC Chairman Dr. Mark Liu. “We are thankful for the continual collaboration that has
brought us here and are pleased to work with our partners in the United States to serve as a base
for semiconductor innovation.”
About TSMC
TSMC pioneered the pure-play foundry business model when it was founded in 1987, and has been
the world’s leading dedicated semiconductor foundry ever since. The Company supports a thriving
ecosystem of global customers and partners with the industry’s leading process technologies and
portfolio of design enablement solutions to unleash innovation for the global semiconductor
industry. With global operations spanning Asia, Europe, and North America, TSMC serves as a
committed corporate citizen around the world.
TSMC deployed 291 distinct process technologies, and manufactured 12,302 products for 535
customers in 2021 by providing broadest range of advanced, specialty and advanced packaging
technology services. TSMC is the first foundry to provide 5-nanometer production capabilities, the
most advanced semiconductor process technology available in the world. The Company is
headquartered in Hsinchu, Taiwan. For more information please visit https://www.tsmc.com.
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TSMC Spokesperson:
Wendell Huang
Vice President and CFO
Tel: 886-3-505-5901
Media Contacts:
Nina Kao
Head of Public Relations
Tel: 886-3-563-6688 ext.7125036
Mobile: 886-988-239-163
E-Mail: nina_kao@tsmc.com
Ulric Kelly
Public Relations
Tel: 886-3-563-6688 ext. 7126541
Mobile: 886-978-111-503
E-Mail: ukelly@tsmc.com