I was not up to speed on this DoD program. Thank you for referencing the latest fact sheet. Nearly all the major US manufacturers are noticeably absent. ON, two GF and one AD locations plus ancient IBM downstate facilities that predate most of the list (all?) but nothing from Micron, Microchip, TI, Intel, or NXP. Most semiconductor components needed for DoD programs are not made by Intel (or Micron and GF). Of course, they want parts that will help keep our assets (soldiers) safe by not failing in their time of need. Shelf stable, durable, and reliable are more important than the latest and greatest technology. Furthermore, fighter jets take decade-plus development cycles, with hardware selections made long before serial production. The most advanced fighter today, the F-22, was designed in the early to mid 1980s with its prototype flying in 1986 and first production flight 11 years later and actual deployment at the end of 2005 - over 20 years of development. Consider the advances in semiconductors during that time, and we know the same thing is occurring now with the next-generation fighter.
What I was commenting on is different, however. The RAMP, RAMP-C, and SHIP programs do include Intel and are outside of the trusted DoD foundry program:
https://www.digitimes.com/news/a202...nited-states-military-industrial-complex.html
https://www.hpcwire.com/off-the-wire/dod-selects-intel-foundry-for-phase-3-of-ramp-c/
https://www.intel.com/content/www/u...cks-intel-foundry-for-ramp-c-phase-three.html