Array ( [content] => [params] => Array (  => /forum/index.php?threads/help-me-understand-semi-production.13834/ ) [addOns] => Array ( [DL6/MLTP] => 13 [Hampel/TimeZoneDebug] => 1000070 [SV/ChangePostDate] => 2010200 [SemiWiki/Newsletter] => 1000010 [SemiWiki/WPMenu] => 1000010 [SemiWiki/XPressExtend] => 1000010 [ThemeHouse/XLink] => 1000970 [ThemeHouse/XPress] => 1010570 [XF] => 2020470 [XFI] => 1040170 ) [wordpress] => /var/www/html )
You could've not summarised it better.There is an enormous amount of secret sauce in manufacturing semis. If it was as easy as buying some off the shelf equipment the Chinese would already be dominant.
I'm sure a lot of folks read this post like me, and remembered dozens (hundreds?) of meetings attended over the years, where a bunch of PhDs debated the relative merits of some tiny little detail of semi design, verification, fabrication, test, etc. Not because the meeting was unnecessary, but because the meeting was so overwhelmingly necessary to work out the myriad complexities inherent at every step. So I think the answer is, you will need a bit more than a couple billion dollars worth of ASML and related tools to build your "high end chip."is there any skill, know-how or R&D that goes into the production or you just need ASML's EUV machine/equipment?
There is an enormous amount of secret sauce in manufacturing semis. If it was as easy as buying some off the shelf equipment the Chinese would already be dominant.
It's simply a matter of having bought how many EUV tools, then you're stuck with them. So then you have to develop the cleaning procedures, etc.EUV is a good example of that. Intel could not make it work for 10nm yet TSMC has EUV at 7nm, 5nm, and 3nm. Samsung also has EUV working but with less success than TSMC. SMIC can't get 14nm yielding and they say they are ready for EUV? Good luck with that.