Memory industry executive brings design and development expertise to lead Everspin’s product development efforts
December 18, 2019 08:00 AM Eastern Standard Time
CHANDLER, Ariz.--(BUSINESS WIRE)--Everspin Technologies, Inc. (NASDAQ: MRAM), the world's leading developer and manufacturer of Magnetoresistive RAM (MRAM), announced that Yong Kim has joined the company as Vice President of Product Development. Starting this week, he will be responsible for all product design engineering for the company. Mr. Kim replaces Thomas Andre who is leaving the company to pursue other interests.
Kim is a 27-year veteran of the semiconductor industry and comes to Everspin most recently from Cypress Semiconductor where he was Vice President of Design leading worldwide development of 3D NAND products. Kim also spent several years at Spansion and AMD prior to Spansion’s acquisition by Cypress.
Kim holds a master’s degree in Electrical Engineering from Santa Clara University and a bachelor’s degree, also in Electrical Engineering, from Oregon State University.
“Yong brings world-class memory development leadership to our engineering team’s strong technical capabilities. His decades of experience leading a variety of non-volatile memory development efforts will be of great value to Everspin as we pursue our long-term roadmap based on our award-winning STT-MRAM technology,” said Kevin Conley, President and CEO of Everspin. “Yong has already been consulting with our development team for a few months prior to this transition. His insights were remarkable and will help lead us in developing, productizing and accelerating our time-to-market for these products.”
Everspin would like to thank Tom Andre for his many significant contributions during his time with the company and wish him the very best in his future endeavors.
About Everspin Technologies
Everspin Technologies, Inc. is the world’s leading provider of Magnetoresistive RAM (MRAM), delivering unprecedented performance, non-volatility, endurance and reliability for applications where data persistence is paramount. Headquartered in Chandler, Arizona, Everspin is transforming the memory market with the largest and most diverse foundation of MRAM customers. For more information, visit www.everspin.com. NASDAQ: MRAM.
Cautionary Statement Regarding Forward-Looking Statements
This press release contains forward-looking statements regarding future events that involve risks and uncertainties that could cause actual results or events to differ materially from the expectations disclosed in the forward-looking statement, including, but not limited to; the anticipated market adoption of Everspin’s products and technology at the rate Everspin expects; the ability for Everspin to expand the markets Everspin addresses at the rate it expects; the risk that unexpected technical difficulties may develop in the final stages of development or production of its products, or when Everspin’s customers may ship in volume. Readers are advised that they should not place undue reliance on these forward-looking statements and should review the risk factors included in Everspin’s Form 10-Q filed with the Securities and Exchange Commission on Nov 7, 2019, under the caption “Risk Factors.” Subsequent events may cause these expectations to change, and Everspin disclaims any obligations to update or alter these forward-looking statements in the future, whether as a result of new information, future events or otherwise.
December 18, 2019 08:00 AM Eastern Standard Time
CHANDLER, Ariz.--(BUSINESS WIRE)--Everspin Technologies, Inc. (NASDAQ: MRAM), the world's leading developer and manufacturer of Magnetoresistive RAM (MRAM), announced that Yong Kim has joined the company as Vice President of Product Development. Starting this week, he will be responsible for all product design engineering for the company. Mr. Kim replaces Thomas Andre who is leaving the company to pursue other interests.
Kim is a 27-year veteran of the semiconductor industry and comes to Everspin most recently from Cypress Semiconductor where he was Vice President of Design leading worldwide development of 3D NAND products. Kim also spent several years at Spansion and AMD prior to Spansion’s acquisition by Cypress.
Kim holds a master’s degree in Electrical Engineering from Santa Clara University and a bachelor’s degree, also in Electrical Engineering, from Oregon State University.
“Yong brings world-class memory development leadership to our engineering team’s strong technical capabilities. His decades of experience leading a variety of non-volatile memory development efforts will be of great value to Everspin as we pursue our long-term roadmap based on our award-winning STT-MRAM technology,” said Kevin Conley, President and CEO of Everspin. “Yong has already been consulting with our development team for a few months prior to this transition. His insights were remarkable and will help lead us in developing, productizing and accelerating our time-to-market for these products.”
Everspin would like to thank Tom Andre for his many significant contributions during his time with the company and wish him the very best in his future endeavors.
About Everspin Technologies
Everspin Technologies, Inc. is the world’s leading provider of Magnetoresistive RAM (MRAM), delivering unprecedented performance, non-volatility, endurance and reliability for applications where data persistence is paramount. Headquartered in Chandler, Arizona, Everspin is transforming the memory market with the largest and most diverse foundation of MRAM customers. For more information, visit www.everspin.com. NASDAQ: MRAM.
Cautionary Statement Regarding Forward-Looking Statements
This press release contains forward-looking statements regarding future events that involve risks and uncertainties that could cause actual results or events to differ materially from the expectations disclosed in the forward-looking statement, including, but not limited to; the anticipated market adoption of Everspin’s products and technology at the rate Everspin expects; the ability for Everspin to expand the markets Everspin addresses at the rate it expects; the risk that unexpected technical difficulties may develop in the final stages of development or production of its products, or when Everspin’s customers may ship in volume. Readers are advised that they should not place undue reliance on these forward-looking statements and should review the risk factors included in Everspin’s Form 10-Q filed with the Securities and Exchange Commission on Nov 7, 2019, under the caption “Risk Factors.” Subsequent events may cause these expectations to change, and Everspin disclaims any obligations to update or alter these forward-looking statements in the future, whether as a result of new information, future events or otherwise.