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ECOC 2019: eSilicon to Demonstrate 7nm 58G DSP-Based SerDes Over Seven-Meter and Three-Meter Samtec Cable Assemblies

Daniel Nenni

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Staff member
For release on September 18, 2019, San Jose, Calif.

eSilicon, a leading provider of FinFET-class ASICs, market-specific IP platforms and advanced 2.5D packaging
solutions, and Samtec, a leading global manufacturer of electronic interconnect solutions, will demonstrate eSilicon’s
7nm 58G DSP-based PAM4/NRZ SerDes capabilities for two challenging data center applications including an
industry-first use of a seven-meter cable assembly from Samtec.

What
eSilicon and Samtec have co-developed system-level solutions that emulate next-generation data center architectures
for typical 19-inch rack-mount applications.

In the first application, eSilicon will demonstrate its SerDes operation over two 67cm AcceleRate® Slim Body Cable
Assemblies and a five-meter (16-foot) ExaMAX® Backplane Cable Assembly providing mid-board to backplane
communications via a cabled backplane architecture from Samtec. This demonstration highlights eSilicon’s SerDes
architecture’s flexibility in supporting independent data rates and protocols on each individual lane, e.g., 50G PAM4
Ethernet, 24G NRZ CPRI and proprietary protocols up to 58Gb/s.

In the second application, eSilicon will demonstrate rack-to-rack communications using ExaMAX® Backplane
Connector paddle cards and a seven-meter (23-foot) ExaMAX Backplane Cable Assembly. This demonstration shows
the performance, robustness and extremely low power consumption of eSilicon’s 7nm 58G PAM4 and NRZ full-DSP
long-reach SerDes in an extreme-use case featuring a total insertion loss of 45dB bump to bump.

A broad set of monitoring and diagnostic tools are available through eSilicon’s SerDes evaluation module kit and its
graphical user interface to control, observe and analyze signal quality and performance metrics across the link in real
time, including:

 Bit error rate (BER) monitor
 Eye diagram monitor
 Equalization capabilities
 Error histogram monitor with post-FEC estimator

Where & When
ECOC 2019
eSilicon Booth 650
September 23-25
Dublin, Ireland

About ECOC
The ECOC Exhibition is the largest optical communications exhibition in Europe, held each September in a different
European city. ECOC 2019 is the key meeting place for decision makers from across the fibre optic communications
technology industry.

About Samtec

Founded in 1976, Samtec is a privately held, $822 MM global manufacturer of a broad line of electronic interconnect
solutions, including High-Speed Board-to-Board, High-Speed Cables, Mid-Board and Panel Optics, Precision RF,
Flexible Stacking, and Micro/Rugged components and cables. With 40+ location servring approximately 125 countries,

Samtec’s global presence enables its unmatched customer service. For more information, please visit
www.samtec.com.

About eSilicon
eSilicon provides complex FinFET ASICs, market-specific IP platforms and advanced 2.5D packaging solutions. Our
ASIC-proven, differentiating IP includes highly configurable 7nm 58G/112G SerDes plus networking-optimized
16/14/7nm FinFET IP platforms featuring HBM2 PHY, TCAM, specialized memory compilers and I/O libraries. Our
neuASIC™ platform provides AI-specific IP and a modular design methodology to create adaptable, highly efficient AI
ASICs. eSilicon serves the high-bandwidth networking, high-performance computing, AI and 5G infrastructure markets.
www.esilicon.com

Collaborate. Differentiate. Win.™

###

eSilicon is a registered trademark, and the eSilicon logo, neuASIC and “Collaborate. Differentiate. Win.” are
trademarks, of eSilicon Corporation. Other trademarks are the property of their respective owners.
 
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