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What going on with the obvious drop in "Others" - you would have assumed that these numbers would only increase over the years ? Was that Intel disposing of some early EUV machines ? Or someone else ?
What going on with the obvious drop in "Others" - you would have assumed that these numbers would only increase over the years ? Was that Intel disposing of some early EUV machines ? Or someone else ?
What going on with the obvious drop in "Others" - you would have assumed that these numbers would only increase over the years ? Was that Intel disposing of some early EUV machines ? Or someone else ?
These are tool production per year, not aggregate # of EUV tools. So "Others" going down from '18 -> '19 or '19 -> 20 depending on which chart, just signifies that of what ASML was able to produce that year, the majority went to T / S. For Samsung, also not entirely clear if that volume of tools is just for logic or also logic + DRAM. TSMC and Samsung both started mass production of technologies (N7+ and S7LPP) in 2019, but the demands for N5 in terms of # of EUV layers is higher than for S5, and TSMC now produces both N7+ and N6 nodes, concurrent to N5 at different factories, all of which consume many EUV layers and thus tools. Samsung OTOH only produced maybe 2-3 designs on S7LPP before introducing S5LPE, and these are effectively the same node / same factory, just different std cell library used in the latter.
Samsung's allocation between DRAM and foundry is still unknown; perhaps that is undercounted. TSMC's portion is still expected to be the majority, based on the number of fabs and layers where EUV is allocated. With the total known, and a reasonable range of estimates for TSMC, Samsung, and even Intel, very few are left. SK Hynix was mentioned to have two by end of this year: https://english.etnews.com/20210629200001
Samsung's new five-layer EUV process enables the industry’s highest DRAM bit density, enhancing productivity by approximately 20% Based on the latest DDR5 standard, Samsung’s 14nm DRAM will be ideal for handling ever-growing AI and 5G workloads
news.samsung.com
This was announced Oct 2021, “begun mass producing”. Samsung Foundry fabs also produce DRAM.
Samsung's new five-layer EUV process enables the industry’s highest DRAM bit density, enhancing productivity by approximately 20% Based on the latest DDR5 standard, Samsung’s 14nm DRAM will be ideal for handling ever-growing AI and 5G workloads
news.samsung.com
This was announced Oct 2021, “begun mass producing”. Samsung Foundry fabs also produce DRAM.
