February 26, 2019
Successful device connection and end-to-end IP connectivity achieved using the CEVA-Dragonfly NB2 3GPP Rel. 14 compliant test chip on Vodafone's NB-IoT test network
BARCELONA, Spain, Feb. 26, 2019 /PRNewswire/ -- #MWC19 - CEVA, Inc. (NASDAQ: CEVA), the leading licensor of signal processing platforms and artificial intelligence processors for smarter, connected devices, announced today that it has successfully completed the first test trials of its CEVA-Dragonfly NB2 silicon at Vodafone's IoT Future Lab in Düsseldorf, Germany. Using Vodafone's open lab facilities which provide a realistic end-to-end live environment of the Narrowband-IoT technology, CEVA connected to the Vodafone NB-IoT network and demonstrated end-to-end IP connectivity with its CEVA-Dragonfly NB2 test chip running a 3GPP NB-IoT Rel.14 compliant software stack.
Michael Boukaya, vice president and general manager of the wireless business unit at CEVA, stated: "This major milestone is yet another key achievement in CEVA's long-term commitment to the massive NB-IoT revolution by enabling new IC players with a fast time-to-market, low risk, low bill-of-materials IP solution that is pre-qualified with tier 1 mobile operators."
The CEVA-Dragonfly NB2 IP solution is a modular technology, composed of the CEVA-X1 IoT processor, an integrated RF Transceiver, baseband, and a protocol stack to offer a complete Release 14 Cat-NB2 modem IP solution that significantly reduces time-to-market and lowers entry barriers. It is a fully software-configurable solution and can be extended with multi-constellation GNSS and sensor fusion functionality. The IP includes a reference silicon of the complete modem design, including an embedded CMOS RF transceiver and PA, an advanced digital front-end, physical layer firmware, and a protocol stack (MAC, RLC, PDCP, RRC, and NAS).
Visit CEVA at #MWC19, February 25-28, hall 7, stand 7A71 and experience the CEVA-Dragonfly NB2 platform, or online at https://www.ceva-dsp.com/product/dragonfly.
The Vodafone IoT Future Lab, located in Vodafone Innovation Park, Düsseldorf, Germany, provides an end-to-end environment for the latest Low Power Wide Area Network (LPWA) technologies in the 3GPP standard: Narrowband-IoT. It incorporates network equipment from three of the most important vendors, and allows for a variety of dedicated test scenarios, e.g. battery consumption measurements under different coverage scenarios.
About CEVA, Inc.
CEVA is the leading licensor of signal processing platforms and artificial intelligence processors for a smarter, connected world. We partner with semiconductor companies and OEMs worldwide to create power-efficient, intelligent and connected devices for a range of end markets, including mobile, consumer, automotive, industrial and IoT. Our ultra-low-power IPs for vision, audio, communications and connectivity include comprehensive DSP-based platforms for LTE/LTE-A/5G baseband processing in handsets, infrastructure and cellular IoT (NB-IoT and Cat-M) enabled devices, advanced imaging and computer vision for any camera-enabled device, audio/voice/speech and ultra-low power always-on/sensing applications for multiple IoT markets. For artificial intelligence, we offer a family of AI processors capable of handling the complete gamut of neural network workloads, on-device. For connectivity, we offer the industry's most widely adopted IPs for Bluetooth (low energy and dual mode) and Wi-Fi (Wi-Fi 4 (802.11n), Wi-Fi 5 (802.11ac) and Wi-Fi 6 (802.11ax) up to 4x4). Visit us at www.ceva-dsp.com and follow us on Twitter, YouTube, Facebook, LinkedIn and Instagram.
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SOURCE CEVA, Inc.
Successful device connection and end-to-end IP connectivity achieved using the CEVA-Dragonfly NB2 3GPP Rel. 14 compliant test chip on Vodafone's NB-IoT test network
BARCELONA, Spain, Feb. 26, 2019 /PRNewswire/ -- #MWC19 - CEVA, Inc. (NASDAQ: CEVA), the leading licensor of signal processing platforms and artificial intelligence processors for smarter, connected devices, announced today that it has successfully completed the first test trials of its CEVA-Dragonfly NB2 silicon at Vodafone's IoT Future Lab in Düsseldorf, Germany. Using Vodafone's open lab facilities which provide a realistic end-to-end live environment of the Narrowband-IoT technology, CEVA connected to the Vodafone NB-IoT network and demonstrated end-to-end IP connectivity with its CEVA-Dragonfly NB2 test chip running a 3GPP NB-IoT Rel.14 compliant software stack.
Michael Boukaya, vice president and general manager of the wireless business unit at CEVA, stated: "This major milestone is yet another key achievement in CEVA's long-term commitment to the massive NB-IoT revolution by enabling new IC players with a fast time-to-market, low risk, low bill-of-materials IP solution that is pre-qualified with tier 1 mobile operators."
The CEVA-Dragonfly NB2 IP solution is a modular technology, composed of the CEVA-X1 IoT processor, an integrated RF Transceiver, baseband, and a protocol stack to offer a complete Release 14 Cat-NB2 modem IP solution that significantly reduces time-to-market and lowers entry barriers. It is a fully software-configurable solution and can be extended with multi-constellation GNSS and sensor fusion functionality. The IP includes a reference silicon of the complete modem design, including an embedded CMOS RF transceiver and PA, an advanced digital front-end, physical layer firmware, and a protocol stack (MAC, RLC, PDCP, RRC, and NAS).
Visit CEVA at #MWC19, February 25-28, hall 7, stand 7A71 and experience the CEVA-Dragonfly NB2 platform, or online at https://www.ceva-dsp.com/product/dragonfly.
The Vodafone IoT Future Lab, located in Vodafone Innovation Park, Düsseldorf, Germany, provides an end-to-end environment for the latest Low Power Wide Area Network (LPWA) technologies in the 3GPP standard: Narrowband-IoT. It incorporates network equipment from three of the most important vendors, and allows for a variety of dedicated test scenarios, e.g. battery consumption measurements under different coverage scenarios.
About CEVA, Inc.
CEVA is the leading licensor of signal processing platforms and artificial intelligence processors for a smarter, connected world. We partner with semiconductor companies and OEMs worldwide to create power-efficient, intelligent and connected devices for a range of end markets, including mobile, consumer, automotive, industrial and IoT. Our ultra-low-power IPs for vision, audio, communications and connectivity include comprehensive DSP-based platforms for LTE/LTE-A/5G baseband processing in handsets, infrastructure and cellular IoT (NB-IoT and Cat-M) enabled devices, advanced imaging and computer vision for any camera-enabled device, audio/voice/speech and ultra-low power always-on/sensing applications for multiple IoT markets. For artificial intelligence, we offer a family of AI processors capable of handling the complete gamut of neural network workloads, on-device. For connectivity, we offer the industry's most widely adopted IPs for Bluetooth (low energy and dual mode) and Wi-Fi (Wi-Fi 4 (802.11n), Wi-Fi 5 (802.11ac) and Wi-Fi 6 (802.11ax) up to 4x4). Visit us at www.ceva-dsp.com and follow us on Twitter, YouTube, Facebook, LinkedIn and Instagram.
Logo - https://mma.prnewswire.com/media/74483/ceva__inc__logo.jpg
SOURCE CEVA, Inc.