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Call for Papers Overview 2020 IEDM CALL FOR PAPERS

Daniel Nenni

Admin
Staff member
The Annual International Electron Devices Meeting
will be held at the Hilton San Francisco Union Square
San Francisco, CA
December 12-16, 2020

DOWNLOAD the 2020 Call for Papers

Abstract Deadline CHANGED to : August 28, 2020

The paper submission deadline has been moved from July to August for submission of four-page, camera-ready papers to provide faster dissemination of the conference’s cutting-edge results. Accepted papers will be published as-is in the proceedings.

Typical themes of interest in IEDM2020:
New or trending areas:

ADVANCED LOGIC TECHNOLOGY (ALT)
• CMOS platform technologies
• Logic device performance and circuit design challenges
• Advanced process integration schemes and scaling approaches
• Process module and process control advancements
• Device technology co-optimization solutions

• SiGe/Ge channel, GAA nanowire and stacked nanosheet
• Stacked and monolithic 3D integration
• BEOL compatible transistors

EMERGING DEVICE and COMPUTE TECHNOLOGY (EDT)
• 2D and devices on low-dimensional materials
• Neuromorphic and approximate computing concepts and devices
• Spintronic and magnetic devices
• Steep-slope devices
• Quantum computing devices

• Topological insulators and phase transition transistors
• Emerging state machines, continuous time dynamical systems

MEMORY TECHNOLOGY (MT)
• Conventional memories
• Emerging memories
• 3D memory technologies
• Computing-in-memory
• Memory for bio-inspired computing

• Novel materials and devices for ferroelectric memories
• Emerging memories for spiking neural networks
• Memory-enabled artificial intelligence applications

MICROWAVE, MILLIMETER WAVE and ANALOG TECHNOLOGY (MAT)
• High Performance III-V and Si devices for mm-wave and THz
• Power device technologies for micro and mm-wave
• Micro and mm-wave analog front ends, PAs, LNAs and mixers
• Energy harvesting devices and circuits
• Tunable passives, SAW/BAW devices, antenna arrays

• Device and circuits for 5G and beyond
• Millimeter-wave power
• Antenna arrays and beam forming

MODELING AND SIMULATION (MS)
• Technology CAD and benchmarking
• Memory and alternative computing device modeling
• Physics-based compact models
• Atomistic process and device modeling
• Design-oriented modeling: variability, reliability and yield

• Atomistic-device hybrid modeling at large scale
• Advanced integration and packaging modeling
• Device and interconnect modeling for quantum computing

OPTOELECTRONICS, DISPLAYS, and IMAGING SYSTEMS (ODI)
• Heterogeneous optoelectronic integration (incl. sources, modulators)
• High-speed wafer-level photonic-electronic integration
• Organic and inorganic displays
• Imagers (high time-resolution, high-sensitivity)
• Large-scale optoelectronic integration for sensors
• Thin film transistors, flexible, stretchable, and printed electronics

• Optoelectronic integration for neuromorphic and quantum computing
• VCSEL sensors, microLED, flexible displays

POWER DEVICES and SYSTEMS (PDS)
• Power devices, modules and systems
• System-level impact of power devices
• Manufacturing processes, device design, modeling, physics, and reliability of power devices
• Fundamental studies on doping, traps, interface states and device reliability for power switching devices[/TD]

• New wide-bandgap semiconductors
• Newer applications from automotive to smart grid
• Power device reliability

RELIABILITY OF SYSTEMS and DEVICES (RSD)
• Reliability of FEOL/MEOL/BEOL, latch‐up and ESD
• Design for reliability and variability-aware design
• Robustness and security of electronic circuits and systems
• Reliability of devices and systems for biomedical, automotive and aerospace

• Degradation mechanisms of emerging memories
• Reliability of devices, circuits and systems for more-than-Moore
• Reliability of biomedical and wearable devices, circuits and systems
• Reliability of 5G, IoT, automotive and aerospace devices circuits and systems

SENSORS, MEMS, and BIOELECTRONICS (SMB)
• Physical and biochemical integrated sensors
• Energy harvesting and storage devices
• Flexible devices for wearable applications
• MEMS for Internet of Things
• Bio-electronics and implantable devices for health applications

• Optomechanical devices and sensors
• Hybrid organic/inorganic
• Sensors and devices for brain computer interfaces

IEEE International Electron Devices Meeting (IEDM) is the world’s preeminent forum for reporting technological breakthroughs in the areas of semiconductor and electronic device technology, design, manufacturing, physics, and modeling. IEDM is the flagship conference for nanometer-scale CMOS transistor technology, advanced memory, displays, sensors, MEMS devices, novel quantum and nano-scale devices and phenomenology, optoelectronics, devices for power and energy harvesting, high-speed devices, as well as process technology and device modeling and simulation.
 
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