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2019 IEEE International Electron Devices Meeting to Highlight Innovative Devices for an Era of Connected Intelligence

Daniel Nenni

Admin
Staff member
35SAN FRANCISCO, CA (August 20, 2019) –The upcoming 65 th annual IEEE International Electron
Devices Meeting (IEDM), to be held December 7-11, 2019 at the Hilton San Francisco Union Square
hotel, will once again feature the latest and most important research taking place in semiconductors
and other electron devices, but with a sharper focus this year on devices intended to support diverse
new applications.

Under the theme “Innovative Devices for an Era of Connected Intelligence,” IEDM 2019 will turn a
brighter spotlight on the processors, memories, 3D architectures, power devices, quantum computing
concepts and other technologies needed for new applications. These applications include artificial
intelligence, mmWave/5G communications, automotive electronics, Internet of Things infrastructure
and systems, and others. Talks on these topics will complement presentations describing breakthroughs
in CMOS scaling, which remains an area of major importance in the semiconductor industry.

At IEDM each year, the world’s best scientists and engineers in the field of microelectronics gather to
participate in a technical program consisting of more than 220 presentations, along with a variety of
panels, focus sessions, tutorials, Short Courses, a supplier exhibit, IEEE/EDS award presentations and
other events highlighting leading work in more areas of the field than any other conference.
This year IEDM once again will feature special Focus Sessions of invited papers on some of today’s
most important areas of research. 1 This year’s Focus Session topics are AI technologies; the human-
machine interface; quantum computing infrastructure; and reliability for circuits and systems.

“IEDM 2019 will feature state-of-the-art results from major semiconductor companies, universities and
other research institutions around the globe, continuing the conference’s tradition of being the premier
venue for the presentation of the highest quality research,” said Rihito Kuroda, IEDM 2019 Publicity
Chair and Associate Professor at Tohoku University. “While CMOS scaling remains very important
and IEDM once again will feature the latest work in that area, many diverse new, fast-growing
applications demand different types of devices. Therefore, we have reorganized the technical
subcommittee structure of IEDM to better align the conference with the innovative semiconductor
concepts and technologies required.”

“The heart of the IEDM conference is the technical program,” said Dina Triyoso, IEDM 2019
Publicity Vice Chair and Technologist at TEL Technology Center America, “but the conference is also
known for the many opportunities it affords attendees to interact directly with the world’s technology
leaders.”

Here are details of the 2019 IEDM:

90-Minute Tutorials – Saturday, Dec. 7
The 90-minute Saturday tutorial sessions on emerging technologies have become a hugely popular part
of IEDM. They are presented by experts in the fields, the goal being to bridge the gap between
textbook-level knowledge and leading-edge current research. The topics for 2019 are:
  • Oxide Semiconductors and TFTs: What is Different from Conventional Semiconductors? Hideo Hosono,
  • Tokyo Institute of Technology
  • Cryogenic MOSFET Modeling, Christian Enz, EPFL
  • FEFE Memory (FRAM, FTJ and NCFETs), Johannes Mueller, GLOBALFOUNDRIES
  • In-Memory Computing for AI, Abu Sebastian, IBM
  • 3D-Monolithic Integration, Perrine Batude, Leti
  • Magnetic Sensors, Keith Green, TI

Short Courses – Sunday, Dec. 8
Early registration for the full-day Sunday Short Courses is recommended, as they are often sold out.
They offer the opportunity to learn about important areas and developments, and to network with
global experts.

 Technology Scaling in the EUV Era and Beyond, organized by Wook-Hyun Kwon, Samsung
o Future of Computing: From Core to Edge Computing, Karim Arabi, Qualcomm
o Logic Transistor Options for 3nm Node and Beyond, Jin Cai, TSMC
o Advanced Processes for Technology Scaling Beyond 3nm, HooChur Kim, Samsung
o Design Technology Co-Optimization for Advanced Scaling, Lars Liebmann, TEL
o Novel Interconnect Techniques for CMOS Technologies in the EUV Era, Chris Wilson, IMEC
o Low-Power Device Solutions for Ultra-Low-Power Computing, Arokia Nathan, Univ. of Cambridge

 Technologies for Memory-Centric Computing, organized by Ali Keshavarzi, Stanford
University
o Emerging Memories on Advanced Technology Nodes, Oleg Golonzka, Intel
o Advanced DRAM, 3D-stacked SDRAM and HBM Technologies, Kyomin Sohn, Samsung
o Novel 3D NAND, Lower Latency NAND and Persistent Memory Technologies, Jian Chen, Western
Digital
o Emerging Memory and AI Technologies, Edith Beigne, Facebook
o Requirements of Advanced Memory Devices, Alessandro Calderoni, Micron Technology
o Advanced Memory-Centric Computing: A Device, Circuit and System Perspective, Arijit
Raychowdhury, Georgia Tech.

Luncheon – Tuesday, Dec. 11
IEDM will have a career-focused luncheon this year featuring industry and scientific leaders talking
about their personal experiences in the context of career growth. It will be moderated by Jungwoo Joh
of Texas Instruments, and this year’s speakers will be Ramune Nagisetty from Intel and Linda
Sommerville from Micron.

Evening Panel Session – Tuesday evening, Dec. 11
IEDM 2019 will offer attendees an evening session where experts will give their views on important
industry topics in a fun, engaging format. Audience participation is encouraged to foster an open and
vigorous exchange of ideas. The title of this year’s evening panel is “Rest in Peace Moore's Law, Long
Live Artificial Intelligence,” organized by Vijay Narayanan, IBM Fellow and Manager, Materials
Research.

Vendor Exhibition/Poster Sessions
 A vendor exhibition will be held once again.
 This year two poster sessions will be held, one on MRAM technology organized by the IEEE
Magnetics Society, the other a student research showcase hosted by the Semiconductor
Research Corporation.

Further information about IEDM
For registration and other information, visit www.ieee-iedm.org.
Follow IEDM via social media
 Twitter: www.ieee-iedm.org/twitter
 LinkedIn: www.ieee-iedm.org/linkedin
 Facebook: www.ieee-iedm.org/facebook

About IEEE & EDS
IEEE is the world’s largest technical professional organization dedicated to advancing technology for
the benefit of humanity. Through its highly cited publications, conferences, technology standards, and
professional and educational activities, IEEE is the trusted voice in a wide variety of areas ranging
from aerospace systems, computers, and telecommunications to biomedical engineering, electric
power, and consumer electronics. Learn more at http://www.ieee.org.
The IEEE Electron Devices Society is dedicated to promoting excellence in the field of electron
devices, and sponsors the IEDM. Learn more at https://eds.ieee.org/.
 
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