April 25, 2023 By Janine Love
In late 2022, the technical program committee for DesignCon 2023 announced the DesignCon Best Paper Awards finalists. Now, they have announced the Best Paper Awards winners. This year, papers authored by Samtec engineers were honored by DesignCon Best Paper Awards as finalistswinner. Ther.
The paper “3D Connection Artifacts in PDN Measurements,” with Istvan Novak and Gustavo Blando of Samtec as part of the authorship team, was recently announced as a DesignCon 2023 Best Paper Award Winner!
Part of Track 10 at DesignCon, the paper’s other authors include engineers from Amazon, Cadence, Oracle, Ampere Computing Inc., and ST Microelectronics. The 26-page paper, “3D Connection Artifacts in PDN Measurements” analyzes via and trace coupling effects using hybrid and full-wave solvers by de-embedding/calibration using multiple test-boards. In the project detailed in the paper, more sophisticated DUT boards were also used to analyze the parasitic probe-via coupling in two-port shunt-through self and transfer impedance PDN measurements.
Robert Branson, Signal Integrity Engineer, Samtec, the lead author on “Cascaded vs End-to-End Multi-Pin Interconnect Simulation Models,” was also honored as a finalist for his paper. DesignCon 2023 was Robert’s first
DesignCon. “Cascaded vs End-to-End Multi-Pin Interconnect Simulation Models” demonstrates the differences between cascaded and end-to-end interconnect models through correlated simulation/measurement models. The analysis uses field plots to show the inaccuracy created by the artificial simulation boundary where models are cut to perform the cascade. The paper also explains how to devise mitigation strategies to decrease simulation time by running cascaded multi-pin connector models while avoiding simulation inaccuracy.
Recipients of DesignCon’s Best Paper Award are selected through a two-step process. First, the DesignCon Technical Program Committee determines the finalists based on quality, relevance, impact, and originality. Winners are then chosen based on the quality of finalists’ presentations at the conference as rated by attendees.
Samtec offers a hearty congratulations to all of the winners and finalists of the DesignCon Best Paper Awards as well as DesignCon’s other program, the Engineer of the Year Awards!
Samtec has a long history of supporting and attending DesignCon. Previous conference papers from Samtec authors and other company white papers are available in the technical resources section of the website.
Link to Press Release
In late 2022, the technical program committee for DesignCon 2023 announced the DesignCon Best Paper Awards finalists. Now, they have announced the Best Paper Awards winners. This year, papers authored by Samtec engineers were honored by DesignCon Best Paper Awards as finalistswinner. Ther.
The paper “3D Connection Artifacts in PDN Measurements,” with Istvan Novak and Gustavo Blando of Samtec as part of the authorship team, was recently announced as a DesignCon 2023 Best Paper Award Winner!
Part of Track 10 at DesignCon, the paper’s other authors include engineers from Amazon, Cadence, Oracle, Ampere Computing Inc., and ST Microelectronics. The 26-page paper, “3D Connection Artifacts in PDN Measurements” analyzes via and trace coupling effects using hybrid and full-wave solvers by de-embedding/calibration using multiple test-boards. In the project detailed in the paper, more sophisticated DUT boards were also used to analyze the parasitic probe-via coupling in two-port shunt-through self and transfer impedance PDN measurements.
Robert Branson, Signal Integrity Engineer, Samtec, the lead author on “Cascaded vs End-to-End Multi-Pin Interconnect Simulation Models,” was also honored as a finalist for his paper. DesignCon 2023 was Robert’s first
DesignCon. “Cascaded vs End-to-End Multi-Pin Interconnect Simulation Models” demonstrates the differences between cascaded and end-to-end interconnect models through correlated simulation/measurement models. The analysis uses field plots to show the inaccuracy created by the artificial simulation boundary where models are cut to perform the cascade. The paper also explains how to devise mitigation strategies to decrease simulation time by running cascaded multi-pin connector models while avoiding simulation inaccuracy.
Recipients of DesignCon’s Best Paper Award are selected through a two-step process. First, the DesignCon Technical Program Committee determines the finalists based on quality, relevance, impact, and originality. Winners are then chosen based on the quality of finalists’ presentations at the conference as rated by attendees.
Samtec offers a hearty congratulations to all of the winners and finalists of the DesignCon Best Paper Awards as well as DesignCon’s other program, the Engineer of the Year Awards!
Samtec has a long history of supporting and attending DesignCon. Previous conference papers from Samtec authors and other company white papers are available in the technical resources section of the website.
Link to Press Release