IRDS™ 2022: Lithography - IEEE IRDS™
irds.ieee.org
Interesting inclusion of DSA (directed self-assembly) among the potential solutions.
Array ( [content] => [params] => Array ( [0] => /forum/index.php?threads/irds-2022-lithography-roadmap-update.16778/ ) [addOns] => Array ( [DL6/MLTP] => 13 [Hampel/TimeZoneDebug] => 1000070 [SV/ChangePostDate] => 2010200 [SemiWiki/Newsletter] => 1000010 [SemiWiki/WPMenu] => 1000010 [SemiWiki/XPressExtend] => 1000010 [ThemeHouse/XLink] => 1000970 [ThemeHouse/XPress] => 1010570 [XF] => 2021370 [XFI] => 1050270 ) [wordpress] => /var/www/html )
Some methods are trying to go well under that but can only be for small samples at least presently, e.g., https://www.zyvexlabs.com/apm/products/zyvector/So is 8 nm 1/2 pitch the end of the line for lithography?