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Will wafer to wafer bonding be the next big advance in semis and how does it compare to silicon on fabric integration? Is AMAT a leader in both? Any thoughts or comments would be appreciated.
Development is improved software modeling and simulation. Die-to-wafer hybrid bonding – Uses copper-to-copper direct interconnect to increase I / O density and reduce wire length between chiplets. This allows parameters such as material selection and packaging architecture to be evaluated and...