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CEVA, Inc. to Present at Upcoming Investor Conferences

Daniel Nenni

Admin
Staff member
August 12, 2019
MOUNTAIN VIEW, Calif., Aug. 12, 2019 /PRNewswire/ -- CEVA, Inc. (NASDAQ: CEVA), the leading licensor of wireless connectivity and smart sensing technologies, announced today that CEVA management will participate in the following upcoming conferences:
  • Jefferies 2019 Semiconductor, Hardware and Communications Infrastructure Summit, August 27th in Chicago, IL.
  • Citi 2019 Global Technology Conference, September 4th in New York, NY.
  • Deutsche Bank Technology Conference, September 10th in Las Vegas, NV.
Where available, CEVA's presentation from the conferences will be streamed via audio webcast. Please visit investors.ceva-dsp.com for more information on how to register and listen.

About CEVA, Inc.
CEVA is the leading licensor of wireless connectivity and smart sensing technologies. We offer Digital Signal Processors, AI processors, wireless platforms and complementary software for sensor fusion, image enhancement, computer vision, voice input and artificial intelligence, all of which are key enabling technologies for a smarter, connected world. We partner with semiconductor companies and OEMs worldwide to create power-efficient, intelligent and connected devices for a range of end markets, including mobile, consumer, automotive, robotics, industrial and IoT. Our ultra-low-power IPs include comprehensive DSP-based platforms for 5G baseband processing in mobile and infrastructure, advanced imaging and computer vision for any camera-enabled device and audio/voice/speech and ultra-low power always-on/sensing applications for multiple IoT markets. For sensor fusion, our Hillcrest Labs sensor processing technologies provide a broad range of sensor fusion software and IMU solutions for AR/VR, robotics, remote controls, and IoT. For artificial intelligence, we offer a family of AI processors capable of handling the complete gamut of neural network workloads, on-device. For wireless IoT, we offer the industry's most widely adopted IPs for Bluetooth (low energy and dual mode), Wi-Fi 4/5/6 (802.11n/ac/ax) and NB-IoT. Visit us at www.ceva-dsp.com and follow us on Twitter, YouTube, Facebook, LinkedIn and Instagram.
Logo - https://mma.prnewswire.com/media/74483/ceva__inc__logo.jpg
SOURCE CEVA, Inc.
 
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