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https://www.bloomberg.com/news/articles/2021-09-23/white-house-weighs-invoking-defense-law-to-get-chip-supply-data
White House to help solve the shortage through usage of Defense Production Act to force semiconductor companies to share information in order to solve the crises
What does the...
I know the chief difficulty is designing each die ahead of time for future 3D packaging (Zen 3D for example). However, I was wondering how difficult leading-edge hybrid CU and direct CU 3D packaging is from an equipment perspective? Is it more on the difficulty level of deposition and etch (i.e...
Can Amd do what Intel is doing and let hyperscalers develop their own custom x86 with co-ip for the data center? Note this is different than amd customizing for customers