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ASML and Samsung are forming a chip alliance and investing $760 million to build a semiconductor research plant in South Korea. From what I can gather the research is for applying EUV in next-generation memory chips...
The latest leaked Intel slides shows that Intel Nova Lake Luna Lake CPU/GPU die is using TSMC's N3B node, rather than N3E.
Most people assumed that N3B would only be used by Apple, and that most TSMC customers would skip it and use N3E instead because N3E has less EUV layers, making it cheaper...
I came across a very good article about how the Chinese have been exploiting loopholes in US export restrictions on lithograhic machines. It explains in great detail how lithographic machines are used in actual production conditions:
https://www.chinatalk.media/p/litho-world-and-commerce-lost-in
A new method for creating a EUV light source using "steady-state microbunching" method:
https://interestingengineering.com/innovation/china-giant-particle-accelerator-microchips
Recently, Huawei claimed to make a breakthrough in EUV light source design and filed a patent. Obviously, they have a long way to go, but could they eventually pull it off and break ASML's monopoly in EUV?
Some interesting facts emerged during a recent Susquehanna conference with Charlie Demerjian. We all know how badly 10nm was delayed, but Charlie maintains that even now the yields are not at production levels and probably never will be. For this reason, Charlie maintains that 10nm laptops will...
In a recent article on Wikichip they claim that Intel's 10nm process is denser than TSMC's 7nm. (https://fuse.wikichip.org/news/2408/tsmc-7nm-hd-and-hp-cells-2nd-gen-7nm-and-the-snapdragon-855-dtco/)
However, I think there were 2 different Intel 10nm nodes. The first was used on Cannonlake and...
Many websites are reporting a new rumour about Nvidia switching to Samsung for their 7nm node. The original rumour source seems to have been a Japanese site "My Navi News": 2019年はどうなる？ PCテクノロジートレンド - その1 プロセス TSMC／Samsung編 (2) Samsung - 7nmのローンチパートナーはIBMとNVIDIA | マイナビニュース
However, if you read...
At IEDM Intel revealed that they will use cobalt in on the bottom two layers of its 10-nm interconnect to get a five- to ten-fold improvement in electromigration and a two-fold reduction in via resistance: https://www.eetimes.com/document.asp?doc_id=1332696
What sort of advantages will Intel...
The die sizes of Intels new Skylake-X and Xeon CPUS have been estimated on Anandtech:
10-core LCC: 308mm2
18-core HCC: 473mm2
28-core XCC: 677mm
AMD has only one die (Zeppelin) which is 194 mm2 and they combine it in an MCM.
The MCM packages is 2 die's for Threadripper and 4 dies for Epyc.
My...
Analysis of Qualcomm's Snapdragon 835 is complete at techinsights: Qualcomm Snapdragon 835 First to 10 nm
So, 48nm x 68nm = 3264
Intel's 14nm is 52nm x 70nm = 3640
-> 11% denser (please feel free to correct me if I made a mistake)
Interesting article at Semiengineering: Semiconductor Engineering .:. Samsung Unveils Scaling, Packaging Roadmaps - Semiconductor Engineering
Samsung foundry is to become a separate business group. More details about Samsung's 8nm, 7nm and 18nm FD-SOI.
To use gate all around transistors for 4nm...
There is an interesting article in FT today that gives a chart of TSMC's biggest clients. Even though Qualcomm have switched to Samsung, they remain TSMC's second biggest client at 11%. Joint third is held by Mediatek, HiSilicon and Nvidia at 5% each.
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According to latest rumors, TSMC will release a new 11.875 nanometer FinFET node, following on the success of their 12nm node.
11.875 nm is almost the same as 12nm, but just a "smidgen" denser, said Mark Liu, TSMC’s co-chief executive in a brief interview. "This is ideal for customers that...
You might have heard the news about Naples, AMD's return to the server market. (AMD Naples - Competition Re-Ignites as Zen Hits the Server Market
How AMD's Naples X86 Server Chip Stacks Up To Intel's Xeons)
The specs look good - Naples handily beats Intel's current Xeons on number of cores...
Rumors are that all foundries (Intel, TSMC and Samsung) are having problems with their 10nm node.
Yield problems at TSMC has caused the delay of MediaTek's Helio X30. Also, Yield problems at Samsung have pushed back the launch of the Galaxy S8 smartphone. This is according to Digitimes: Yields...
There was some speculation that Samsung might change it's plan to use EUV for 7nm, as it's unlikely that EUV will be ready for 2018. However, in Samsung's latest earning call they reiterated their commitment to EUV:
Samsung Electronics' (SSNLF) Management on Q3 2016 Results - Earnings Call...
