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  1. Daniel Payne

    ISQED 2020 - Call for Papers

    Call for Papers 21st ISQED - March 2020, Santa Clara Convention Center, California Submission Deadline: Sept. 14th, 2019 About the Conference A pioneer and leading interdisciplinary conference, the 21st International Symposium on Quality Electronic Design (ISQED2020) accepts and promotes...
  2. Daniel Payne

    ARM Suspends Business With Huawei Just As EE Removes Huawei Phones From 5G launch

    It's just a matter of time before the Chinese government starts to add US Vendors to their own blacklist as a form of retaliation. Back in 2016 my youngest son purchased a Chinese smartwatch on eBay, only to discover that it was sending all of his phone contacts to China, quite the privacy...
  3. Daniel Payne

    Checking out the new SemiWiki web remodel.

    Checking out the new SemiWiki web remodel.
  4. Daniel Payne

    DAC 2019 - Marie Pistilli Award Recipient

    R. Iris Bahar to Receive Marie R. Pistilli Women in Engineering Achievement Award Brown University professor honored for outstanding technical contributions in energy efficient and reliable electronic systems, nanoelectronics, and nanotechnology LOUISVILLE, Colo. – April 24, 2019 –– Iris...
  5. Daniel Payne

    DVCon Europe 2019 to be held on 29th and 30th October in Munich

    Scope broadened to include embedded software. Calls for papers, tutorials and panels issued. Munich, Germany – March 21st, 2019 - The Design and Verification Conference & Exhibition Europe (DVCon Europe), sponsored by Accellera Systems Initiative, has announced the call for papers, tutorials...
  6. Daniel Payne

    2nd MOS-AK India Conference, Feb 25-27, 2019 - Summary

    2019 IEEE International Conference on Modeling of Systems Circuits and Devices Organised by Joint Chapter of CAS /ED Societies, IEEE Hyderabad Section 2nd MOS-AK India Conference (IEEE Conference #45395) Venue: IIT Hyderabad February 25-27, 2019 The MOS-AK Compact Modeling Association, a...
  7. Daniel Payne

    LSCC - stock jumps on Q4 sales and revenue guidance

    Lattice Semi a turnaround story? Shares at highest point in 15 years - oregonlive.com Lattice is the third, but smaller competitor to Xilinx and Intel in the FPGA market.
  8. Daniel Payne

    Another automation approach for analog schematic porting

    Thalia-DA unveils AMALIA analog schematic porting capability Automation accelerates analog design reuse projects by up to 50% CWMBRAN, UK 7 February 2019 - Thalia Design Automation today introduces advanced analog schematic porting capabilities within its AMALIA analog design automation tool...
  9. Daniel Payne

    Who is the CEO Emeritus at Mentor?

    Walden Rhines is officially now the CEO Emeritus at Mentor, as Tony Hemmelgarn takes the CEO title. Executive Team - Mentor Graphics I would typically expect a press release issued about a change in CEO title. Siemens has done a fine job acquiring Mentor and letting the product divisions...
  10. Daniel Payne

    11th annual MOS-AK Workshop Summary, Silicon Valley, December 5, 2018

    Modeling of Systems and Parameter Extraction Working Group Summary of the 11th International MOS-AK Workshop Silvaco Inc. Headquarters, Silicon Valley, December 5, 2018 The MOS-AK Compact Modeling Association, a global standardization forum for semiconductor device models, held its 11th MOS-AK...
  11. Daniel Payne

    How safe is it to work in a fab?

    I live in Oregon and wonder about how safe it is for Intel workers in the fab, or even neighbors living nearby. Emergency crews back at Intel for another possible toxic exposure incident | OregonLive.com Intel: ‘no hazardous materials release’ in incident that sent 15 to the hospital |...
  12. Daniel Payne

    Intento Design offers analog circuit sizing tool through CMP

    INTENTO DESIGN and CMP Make Evaluation of ID-Xplore™ Tool Available through CMP Agreement gives CMP users a remote or on site access to for evaluation of Intento Design ID-Xplore™ Analog Design Exploration Tool Grenoble, France - November 21st, 2018 - INTENTO DESIGN and...
  13. Daniel Payne

    16th MOS-AK Workshop at ESSDERC/ESSCIRC

    MOS-AK Workshop Dresden 2018 Dresden, Sept. 3, 2018 The MOS-AK Compact Modeling Association, a global compact/SPICE modeling and Verilog-A standardization forum, held its 16th MOS-AK Workshop in the timeframe of ESSDERC/ESSCIRC. The event was hosted on September 3rd, 2018, by the TU Dresden in...
  14. Daniel Payne

    Drones used for assassination attempt

    I've always wondered why it took so long for the bad guys to use technology like drones and robots for political assassinations or even bank robberies. From the report in Venezuela it sounds like the security team was able to thwart the path of the drones and steer them away from the intended...
  15. Daniel Payne

    20th ISQED - Call for papers, deadline September 10th, 2018

    About the ConferenceA pioneer and leading interdisciplinary conference, the 20th International Symposium on Quality Electronic Design (ISQED2019) accepts and promotes original and unpublished papers related to the topics shown below. ISQED 2019 theme is Security, IoT, Machine Learning and...
  16. Daniel Payne

    ISQED - March 2019, Call for Papers (Santa Clara)

    Submission Deadline: Sept. 10th, 2018 About the Conference A pioneer and leading interdisciplinary conference, the 20th International Symposium on Quality Electronic Design (ISQED2019) accepts and promotes original and unpublished papers related to the topics shown below. ISQED 2019 theme is...
  17. Daniel Payne

    DAC55 is coming to SFO on June 24th, looks who's going to be there

    LOUISVILLE, CO—April 18, 2018— When the 55th Design Automation Conference opens June 24, a record number of first-time and returning exhibitors will greet design engineers. Exhibitors such as NEC Corporation, IBM Corporation, Amazon Web Services (AWS), Alibaba Cloud Services, Pvt. Limited and...
  18. Daniel Payne

    ESD Alliance joins SEMI

    Given all the merger activity in the EDA, semiconductor and IP worlds, it comes as no surprise that our industry associations also have mergers, so the ESD Alliance (aka EDAC) joined SEMI this week and will continue with business as usual. I've attended both SEMI and ESD Alliance events, and the...
  19. Daniel Payne

    2018 ICCAD - Call For Papers

    Abstract Deadline: Monday, April 16, 2018 Paper Deadline: Monday, April 23, 2018 Paper Topic Areas: System-Level CAD Synthesis, Verification, & Physical Design SOC Analysis, Design, Simulation, And Testing CAD for Emerging Technologies, Paradigms, & Applications Call for Papers
  20. Daniel Payne

    I LOVE DAC, get into the exhibits for free

    Avatar Integrated Systems, ClioSoft, and Truechip Sponsor the Tenth Annual I LOVE DAC Campaign at the 55rd Design Automation Conference Free three-day exhibition passes with access to keynotes, exhibits, DAC Pavilion, IP Speaks and Design-on-Cloud presentations LOUISVILLE, Colo. – March 21...
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