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Search results

  1. F

    TSMC plans Arizona water treatment and recycling

    I was checking where the distinction was made earlier, a couple of mentions here: https://www.techspot.com/news/96847-tsmc-2024-arizona-fab-upgrade-5nm-4nm-after.html, and https://www.gizmochina.com/2023/03/20/tsmc-arizona-plant-4nm-chip-production-next-year/ Although interestingly the alleged...
  2. F

    How to develop EUV photoresists without an EUV machine?

    To be realistic, it needs to have the hydrogen plasma ambient.
  3. F

    TSMC plans Arizona water treatment and recycling

    https://focustaiwan.tw/business/202304040011 In a statement, TSMC said it planned to construct a water recycling facility to meet the needs of its advanced wafer fabs in Phoenix, adding that it would also build a comprehensive waste-water treatment system to reduce consumption and increase...
  4. F

    How to develop EUV photoresists without an EUV machine?

    This is what TSMC does: https://semiwiki.com/forum/index.php?threads/tsmc-to-lease-euv-machines-to-domestic-euv-photoresist-suppliers-this-year.15956/
  5. F

    Chinese smartphone maker Oppo abruptly closes chip design unit Zeku

    Back in February, there was a report of a 4nm tapeout from Zheku: https://www.myfixguide.com/oppos-4nm-mobile-phone-processor/ Apparently, it will not come to fruition, mainly to the surprise of Zheku. Very likely could not get the 4nm capacity at TSMC. This likely will escalate tensions with China.
  6. F

    Taiwan Is Running Low on a Strategic Asset: Engineers

    Aren't they building the solution, AI, or is that just exacerbating the problem?
  7. F

    Samsung to share node information at VLSI symposium.

    Interesting enough, they admit being behind TSMC: https://www.hankyung.com/economy/article/202305044261i 2 years behind in 4nm, 1 year behind in 3nm. Five years to catch up.
  8. F

    Impact of TSMC customer order cutback

    Yes, except for the CPU tile, the others (GPU, I/O, SoC) are expected to be made at TSMC. So the Meteor Lake launch is key.
  9. F

    Impact of TSMC customer order cutback

    That's correct, the statement about TSMC customers was from the author, not C. C. Wei.
  10. F

    Impact of TSMC customer order cutback

    https://english.cw.com.tw/article/article.action?id=3417 "TSMC is betting that the first half of the year will be remembered as the darkness before the dawn. Revenue will bottom out during the second quarter, but the semiconductor industry will then begin to rebound. However, the forecast for...
  11. F

    Mono-3D DRAM claim

    Right, presumably thin only at the gate oxide portion under the floating body in the diagram.
  12. F

    Mono-3D DRAM claim

    The main issue with the diagram is leaking between the bit line and word line through the vertical white strip, and between the word line and source, through a horizontal portion.
  13. F

    Mono-3D DRAM claim

    I haven't studied all of them yet, but at least several had the capacitor lying on its side, so to speak. Neo Semi appears to be claiming the transistor's own floating body as the capacitor.
  14. F

    Mono-3D DRAM claim

    The bit line (which conducts current) is adjacent the word line (which functions as a gate) separated by very thin insulation. Source line is likewise separated from the word line by thin insulation. These appear to be parasitic capacitances and leakage sources. As I understood the...
  15. F

    Mono-3D DRAM claim

    Their diagram seems wrong
  16. F

    TSMC seeking up to $15 billion from federal government for Arizona chip plants

    I know how the US govt works, I'm from the States. :) I might have been thinking of the proposed FABS act for AMD, NVIDIA and Qualcomm, which might indirectly help TSMC. Otherwise, TSMC might have to limit its charges for the US fabs (to limit its own profits). From...
  17. F

    TSMC seeking up to $15 billion from federal government for Arizona chip plants

    Fabless TSMC customers in US could apply for the CHIPS subsidies, but perhaps TSMC needs to apply for non-CHIPS subsidy, i.e., not need to follow the profits-sharing. The application process itself may involve sharing corporate confidential information.
  18. F

    China’s top chipmaker will ‘struggle’ to make cutting-edge chips competitively

    nghanayem covered the points well. For the N3E pitch of 23 nm, DUV SAQP would be the safest and also works well with 5 tracks.
  19. F

    China’s top chipmaker will ‘struggle’ to make cutting-edge chips competitively

    It's a bit different here, since they can't ship Meteor Lake without TSMC. Even 18A will have TSMC participation wherever there's an Intel CPU. At least with Intel 7 they had their independence. Being a TSMC customer, you have to pay to reserve the capacity. All for the sake of using EUV, which...
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