Array
(
    [content] => 
    [params] => Array
        (
            [0] => /forum/index.php?search/178913/
        )

    [addOns] => Array
        (
            [DL6/MLTP] => 13
            [Hampel/TimeZoneDebug] => 1000070
            [SV/ChangePostDate] => 2010200
            [SemiWiki/Newsletter] => 1000010
            [SemiWiki/WPMenu] => 1000010
            [SemiWiki/XPressExtend] => 1000010
            [ThemeHouse/XLink] => 1000970
            [ThemeHouse/XPress] => 1010570
            [XF] => 2021171
            [XFI] => 1050270
        )

    [wordpress] => /var/www/html
)

Search results

  1. F

    Intel 18A tapeout without High-NA EUV

    One direction per layer at 30-36 nm pitch. Larger pitches can be combined x/y.
  2. F

    Intel 18A tapeout without High-NA EUV

    CPP cannot be aggressive shrink, perhaps track number. 30-36 nm pitch direct print is still unidirectional lines and cuts. Perhaps they mean to allow both x and y lines, each unidirectional.
  3. F

    Intel 18A tapeout without High-NA EUV

    After all this time, including time spent with TSMC over 3nm, Intel 18A will not have lower minimum metal pitch than Intel 4. https://www.spiedigitallibrary.org/conference-proceedings-of-spie/12292/1229202/Direct-print-EUV-patterning-of-tight-pitch-metal-layers-for/10.1117/12.2641744.short
  4. F

    FAKE NEWS: TSMC's 3nm foundry price breaks through $20,000, iPhone 15, GPU price increase

    ~1 layer/day is not unreasonable, some tools are not running at advertised WPH, and any maintenance downtime easily leads to hours of idling. Any critical metrology may also add substantial time between actual processing steps, but it would be necessary to get the information to dial in the next...
  5. F

    TSMC’s U.S. Engineers Are “Babies” Say Taiwanese After The Former Leave For America

    What are densities on actual products? They could likely be much lower than advertised for the nodes.
  6. F

    FAKE NEWS: TSMC's 3nm foundry price breaks through $20,000, iPhone 15, GPU price increase

    On the order of $500K for EUV, $100-200K for ArFi, $5000 for 14nm wafer. I found one plot in the previously attached report interesting, where fewer wafers did not favor EUV at all (ArF multipatterning preferred).
  7. F

    Baidu shrugs off US chip export restrictions

    https://finance.yahoo.com/news/chinas-baidu-shrugging-off-us-134300969.html In an earnings call yesterday (Nov. 22), Robin Li, Baidu’s CEO, said that his company’s cloud computing and artificial intelligence business “[do] not rely too much on the high advanced chips.” Where such chips are...
  8. F

    FAKE NEWS: TSMC's 3nm foundry price breaks through $20,000, iPhone 15, GPU price increase

    Impact of mask costs on patterning strategy: https://www.euvlitho.com/2017/P33.pdf
  9. F

    FAKE NEWS: TSMC's 3nm foundry price breaks through $20,000, iPhone 15, GPU price increase

    Mask prices can be much higher, but they are amortized over many wafers of course.
  10. F

    Are CANON going to be back in the game?

    In this month's SPIE volume 12293, paper 122930P gives the general update from Canon Nanotechnologies while 122930Q talks about requiring double patterning for the electron beam lithography for the template. Nanoimprint is being sold as an alternative to multipatterning on the wafer but actually...
  11. F

    TSMC sending first batch of 300 people on charter flight to Phoenix

    It would all make sense if these employees were explicitly hired for Arizona, not plucked out from established TW employees. In the latter case, you would have to replace them.
  12. F

    TSMC sending first batch of 300 people on charter flight to Phoenix

    I was wondering if the report was true. It had mentioned: "In the future, TSMC will have 6 chartered flights to send more than 1,000 Taiwanese engineers to Arizona."
  13. F

    TSMC sending first batch of 300 people on charter flight to Phoenix

    With over 1000 vacancies in Taiwan coming up, there should be some news here about hiring the replacements, we'll see.
  14. F

    TSMC sending first batch of 300 people on charter flight to Phoenix

    This brings in the second phase of culture shock, from work culture differences. They can hire experienced staff from Intel as well.
  15. F

    TSMC and the CHIPS Act

    Labor cost is location-sensitive.
  16. F

    TSMC and the CHIPS Act

    EUV is not a must-have for DRAM cell patterning since it is a fixed pitch pattern amenable to self-aligned patterning. There are also not many metal layers. So it's not as dramatic a severe multipatterning case as with foundry.
  17. F

    TSMC sending first batch of 300 people on charter flight to Phoenix

    I don't know if hiring Americans was supposed to be a major part of the deal. Certainly spirit of CHIPS was like that.
  18. F

    TSMC sending first batch of 300 people on charter flight to Phoenix

    If true, they are filling most of the positions supposedly for local hires.
  19. F

    TSMC sending first batch of 300 people on charter flight to Phoenix

    I've had good Arizonan food. The weather being hot and dry could be a noticeable difference but the business language (Chinese vs. English) is where the even subtle cultural differences matter most.
Top