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Cadence TECHTALK: Reduce Turnaround Times with an RF/microwave Front-to-Back PCB Workflow
Cadence TECHTALK: Reduce Turnaround Times with an RF/microwave Front-to-Back PCB Workflow
Date: Thursday, November 10, 2022 Time: 9:00am - 10:00am (PDT) RF/microwave IP, developed in a specialized design environment, must be transferred to a PCB layout editor where manufacturing constraints, design rule checking (DRC), layout vs. schematic (LVS), and corporate-approved components can be applied and integrated with the power and digital electronics. The transfer of RF …