As semiconductors continue to scale, designers are turning to 3DIC architectures to meet increasing demands for performance, energy efficiency, and functional density in data centers and edge AI applications. However, …
Continue reading "Webinar: Powering 3D Multi-Die Designs with RedHawk-SC Electrothermal"
As power integrity challenges increase with advanced nodes and multi-die architectures, EMIR analysis must evolve beyond traditional signoff. In this Synopsys webinar, we will show how RedHawk-SC is expanding its capabilities …
Continue reading "Webinar: RedHawk-SC: From EMIR Signoff to IR-Aware Design Closure"
In this webinar, Intel will present how EMIB-T (Embedded Multi-die Interconnect Bridge with TSVs) enables compact, cost-effective multi‑die design while sustaining the bandwidth and power efficiency required for AI and datacenter designs. …
Featured Speaker: Victoria Kolesov, Principal Engineer, Intel In this Synopsys webinar, Intel will present how its disaggregated designs across client and server platforms have driven the evolution of robust 3D …
Join us for our 6th Annual Virtual Prototyping Day and learn how you can "shift left" your development cycle with virtual prototypes. Highly complex SoC and muti-die designs are putting pressure …
Date: Jun 25, 2026 | 9:00 AM PST In this webinar, Intel will present how EMIB (Embedded Multi‑die Interconnect Bridge) enables compact, cost-effective multi‑die design while sustaining the bandwidth and power efficiency required for …
